Datasheet Texas Instruments 74AC16244 — Ficha de datos

FabricanteTexas Instruments
Serie74AC16244
Datasheet Texas Instruments 74AC16244

Búferes de 16 bits y controladores de línea con salidas de 3 estados

Hojas de datos

16-Bit Buffers/Line Drivers With 3-State Outputs datasheet
PDF, 366 Kb, Revisión: A, Archivo publicado: abr 1, 1996
Extracto del documento

Precios

Estado

74AC16244DGGR74AC16244DGGRG474AC16244DL74AC16244DLG474AC16244DLR
Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNoNoNoNoNo

Embalaje

74AC16244DGGR74AC16244DGGRG474AC16244DL74AC16244DLG474AC16244DLR
N12345
Pin4848484848
Package TypeDGGDGGDLDLDL
Industry STD TermTSSOPTSSOPSSOPSSOPSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY2000200025251000
CarrierLARGE T&RLARGE T&RTUBETUBELARGE T&R
Device MarkingAC16244AC16244AC16244AC16244AC16244
Width (mm)6.16.17.497.497.49
Length (mm)12.512.515.8815.8815.88
Thickness (mm)1.151.152.592.592.59
Pitch (mm).5.5.635.635.635
Max Height (mm)1.21.22.792.792.79
Mechanical DataDescargarDescargarDescargarDescargarDescargar

Paramétricos

Parameters / Models74AC16244DGGR
74AC16244DGGR
74AC16244DGGRG4
74AC16244DGGRG4
74AC16244DL
74AC16244DL
74AC16244DLG4
74AC16244DLG4
74AC16244DLR
74AC16244DLR
Bits1616161616
F @ Nom Voltage(Max), Mhz6060606060
ICC @ Nom Voltage(Max), mA0.080.080.080.080.08
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85
Output Drive (IOL/IOH)(Max), mA-24/24-24/24-24/24-24/24-24/24
Package GroupTSSOPTSSOPSSOPSSOPSSOP
Package Size: mm2:W x L, PKG48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)
RatingCatalogCatalogCatalogCatalogCatalog
Schmitt TriggerNoNoNoNoNo
Technology FamilyACACACACAC
VCC(Max), V5.55.55.55.55.5
VCC(Min), V33333
Voltage(Nom), V3.3,53.3,53.3,53.3,53.3,5
tpd @ Nom Voltage(Max), ns11.8,7.911.8,7.911.8,7.911.8,7.911.8,7.9

Plan ecológico

74AC16244DGGR74AC16244DGGRG474AC16244DL74AC16244DLG474AC16244DLR
RoHSObedienteObedienteObedienteObedienteObediente

Notas de aplicación

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  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Archivo publicado: jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, Archivo publicado: agosto 29, 2002
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    PDF, 89 Kb, Revisión: B, Archivo publicado: jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
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    PDF, 1.7 Mb, Archivo publicado: oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Kb, Archivo publicado: abr 1, 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

Linea modelo

Clasificación del fabricante

  • Semiconductors> Logic> Buffer/Driver/Transceiver> Non-Inverting Buffer/Driver