Datasheet Texas Instruments MSP430F2618-EP — Ficha de datos

FabricanteTexas Instruments
SerieMSP430F2618-EP
Datasheet Texas Instruments MSP430F2618-EP

Producto mejorado MCU de 16 bits de potencia ultrabaja, Flash de 92 KB, RAM de 8 KB, ADC de 12 bits, DAC dual, 2 USCI

Hojas de datos

Mixed Signal Microcontroller datasheet
PDF, 1.2 Mb, Archivo publicado: dic 15, 2008
Extracto del documento

Precios

Estado

MSP430F2618TGQWTEPV62/09620-01XA
Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricante

Embalaje

MSP430F2618TGQWTEPV62/09620-01XA
N12
Pin113113
Package TypeGQWGQW
Industry STD TermBGA MICROSTAR JUNIORBGA MICROSTAR JUNIOR
JEDEC CodeS-PBGA-NS-PBGA-N
Package QTY250250
CarrierSMALL T&RSMALL T&R
Device MarkingF2618GQWEPF2618GQWEP
Width (mm)77
Length (mm)77
Thickness (mm).74.74
Pitch (mm).5.5
Max Height (mm)11
Mechanical DataDescargarDescargar

Paramétricos

Parameters / ModelsMSP430F2618TGQWTEP
MSP430F2618TGQWTEP
V62/09620-01XA
V62/09620-01XA
ADCADC12 - 8chADC12 - 8ch
AESN/AN/A
Active Power, uA/MHz365365
Additional FeaturesWatchdog,DAC,Temp Sensor,Brown Out ResetWatchdog,DAC,Temp Sensor,Brown Out Reset
BSLUARTUART
CPUMSP430MSP430
ComparatorsYesYes
DMA33
Frequency, MHz1616
GPIO4848
I2C22
Max VCC3.63.6
Min VCC1.81.8
Multiplier16x1616x16
Non-volatile Memory, KB116116
Operating Temperature Range, C-40 to 105-40 to 105
Package GroupBGA MICROSTAR JUNIORBGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)
RAM, KB88
RatingHiRel Enhanced ProductHiRel Enhanced Product
SPI22
Special I/ON/AN/A
Standby Power, LPM3-uA0.50.5
Timers - 16-bit22
UART22
Wakeup Time, us11

Plan ecológico

MSP430F2618TGQWTEPV62/09620-01XA
RoHSSee ti.comSee ti.com

Notas de aplicación

  • Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)
    PDF, 237 Kb, Revisión: E, Archivo publicado: mayo 4, 2018
    This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Kb, Revisión: A, Archivo publicado: abr 1, 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl

Linea modelo

Serie: MSP430F2618-EP (2)

Clasificación del fabricante

  • Semiconductors> Space & High Reliability> Microcontroller> Low Power MCU> MSP430 MCU