Datasheet Texas Instruments MSP430F5229 — Ficha de datos

FabricanteTexas Instruments
SerieMSP430F5229
Datasheet Texas Instruments MSP430F5229

E / S de riel dividido de 1,8 V de potencia ultrabaja

Hojas de datos

MSP430F522x, MSP430F521x Mixed-Signal Microcontrollers datasheet
PDF, 2.1 Mb, Revisión: G, Archivo publicado: jun 28, 2016
Extracto del documento

Precios

Estado

MSP430F5229IRGCRMSP430F5229IRGCTMSP430F5229IYFFRMSP430F5229IYFFTMSP430F5229IZQEMSP430F5229IZQER
Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNoNoNoNo

Embalaje

MSP430F5229IRGCRMSP430F5229IRGCTMSP430F5229IYFFRMSP430F5229IYFFTMSP430F5229IZQEMSP430F5229IZQER
N123456
Pin646464648080
Package TypeRGCRGCYFFYFFZQEZQE
Industry STD TermVQFNVQFNDSBGADSBGABGA MICROSTAR JUNIORBGA MICROSTAR JUNIOR
JEDEC CodeS-PQFP-NS-PQFP-NR-XBGA-NR-XBGA-NS-PBGA-NS-PBGA-N
Package QTY200025025002503602500
CarrierLARGE T&RSMALL T&RLARGE T&RSMALL T&RJEDEC TRAY (5+1)LARGE T&R
Device MarkingF5229F5229M430F5229M430F5229F5229F5229
Width (mm)9955
Length (mm)9955
Thickness (mm).88.88.4.4.74.74
Pitch (mm).5.5.4.4.5.5
Max Height (mm)11.625.62511
Mechanical DataDescargarDescargarDescargarDescargarDescargarDescargar

Paramétricos

Parameters / ModelsMSP430F5229IRGCR
MSP430F5229IRGCR
MSP430F5229IRGCT
MSP430F5229IRGCT
MSP430F5229IYFFR
MSP430F5229IYFFR
MSP430F5229IYFFT
MSP430F5229IYFFT
MSP430F5229IZQE
MSP430F5229IZQE
MSP430F5229IZQER
MSP430F5229IZQER
ADCADC10 - 10chADC10 - 10chADC10 - 10chADC10 - 10chADC10 - 10chADC10 - 10ch
AESN/AN/AN/AN/AN/AN/A
Active Power, uA/MHz404404404404404404
Additional FeaturesReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDAReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA
BSLUARTUARTUARTUARTUARTUART
CPUMSP430MSP430MSP430MSP430MSP430MSP430
Comparators888888
DMA333333
Featuredf5f5f5f5f5f5
Frequency, MHz252525252525
GPIO Pins535353535353
I2C222222
Max VCC3.63.63.63.63.63.6
Min VCC1.81.81.81.81.81.8
Multiplier32x3232x3232x3232x3232x3232x32
Non-volatile Memory, KB128128128128128128
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85
Package GroupVQFNVQFNDSBGADSBGABGA MICROSTAR JUNIORBGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG64VQFN: 81 mm2: 9 x 9(VQFN)64VQFN: 81 mm2: 9 x 9(VQFN)See datasheet (DSBGA)See datasheet (DSBGA)80BGA MICROSTAR JUNIOR: 25 mm2: 5 x 5(BGA MICROSTAR JUNIOR)80BGA MICROSTAR JUNIOR: 25 mm2: 5 x 5(BGA MICROSTAR JUNIOR)
RAM, KB888888
RatingCatalogCatalogCatalogCatalogCatalogCatalog
SPI444444
Special I/O1.8V I/O1.8V I/O1.8V I/O1.8V I/O1.8V I/O1.8V I/O
Standby Power, LPM3-uA2.52.52.52.52.52.5
Timers - 16-bit444444
UART222222
Wakeup Time, us3.53.53.53.53.53.5

Plan ecológico

MSP430F5229IRGCRMSP430F5229IRGCTMSP430F5229IYFFRMSP430F5229IYFFTMSP430F5229IZQEMSP430F5229IZQER
RoHSObedienteObedienteObedienteObedienteObedienteObediente

Notas de aplicación

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    Hardware and layout limitations often require smaller package sizes that could potentially create a tradeoff for the number of serial peripherals available to the user. With the I2C protocol, special software can be created to use a pair of simple GPIO ports to emulate an I2C master device. This allows programmers to be flexible with pin assignments and enables smaller package devices to overcome
  • Low-Power Pedometer Using an MSP430 MCU
    PDF, 182 Kb, Archivo publicado: mayo 28, 2013
    This application report describes a low-power pedometer example application that uses an MSP430F5229 microcontroller and the TI Pedometer firmware algorithm. This application was developed and targeted for the health and fitness markets.Fitness monitors typically measure both a person's amount and rate of exercise (traveled distanced and pace) as well as effort expended (calories burned in the p
  • Enabling Low-Power Windows 8 HID Over I2C Applications Using MSP430 MCUs
    PDF, 1.4 Mb, Archivo publicado: nov 30, 2012
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  • Designing with MSP430F522x and MSP430F521x Devices
    PDF, 72 Kb, Archivo publicado: nov 30, 2012
    The MSP430F522x and MSP430F521x devices support a split supply I/O system that is essential in systems in which the MCU is required to interface with external devices (such as sensors or other processors) that operate at different voltage level compared to the MCU device supply. Additionally, the split supply input voltage range of the F522x and F521x devices starts as low as 1.62 V (see the devic
  • Using the MSP430 Timer_D Module in Hi-Resolution Mode
    PDF, 870 Kb, Archivo publicado: oct 2, 2013
    This application report describes the use of the high-resolution feature of the Timer_D module introduced in MSP430F51x1 and MSP430F51x2 devices. Timer_D enables applications that require high resolution such as capacitive touch detection, PWM DACs, advanced LED lighting, and digital controllers for power supplies. This application report provides an advanced description of the use and calibration
  • Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)
    PDF, 151 Kb, Revisión: D, Archivo publicado: nov 3, 2016
    This application report helps enable easy migration from MSP430F5xx and MSP430F6xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx FRAM-based MCUs. For the migration guide to MSP430FR57xx, see Migrating From the MSP430F2xx Family to the MSP430FR57xx Family. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight differences between the
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Kb, Revisión: A, Archivo publicado: abr 1, 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • Design Considerations When Using the MSP430 Graphics Library
    PDF, 475 Kb, Archivo publicado: oct 5, 2012
    LCDs are a growing commodity in todays market with products as diverse as children's toys to medical devices. Modern LCDs, along with the graphics displayed on them, are growing in complexity. A graphics library can simplify and accelerate development while creating the desired user experience. TI provides the MSP430 Graphics Library for use in developing products with the MSP430в„ў MCU. This
  • ESD Diode Current Specification
    PDF, 520 Kb, Archivo publicado: dic 7, 2015
    This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.
  • MSP Code Protection Features
    PDF, 752 Kb, Archivo publicado: dic 7, 2015
    MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur

Linea modelo

Clasificación del fabricante

  • Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430F5x/6x