Datasheet Texas Instruments SN54ALS652 — Ficha de datos

FabricanteTexas Instruments
SerieSN54ALS652
Datasheet Texas Instruments SN54ALS652

Transceptores y registros de bus octal con salidas de 3 estados

Hojas de datos

Octal Bus Transceivers And Registers With 3-State Outputs datasheet
PDF, 793 Kb, Revisión: G, Archivo publicado: dic 7, 2000
Extracto del documento

Precios

Estado

5962-88673013A5962-8867301KA5962-8867301LASN54ALS652JTSNJ54ALS652FKSNJ54ALS652JTSNJ54ALS652W
Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)Obsoleto (El fabricante ha interrumpido la producción del dispositivo)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Obsoleto (El fabricante ha interrumpido la producción del dispositivo)
Disponibilidad de muestra del fabricanteNoNoNoNoNoNoNo

Embalaje

5962-88673013A5962-8867301KA5962-8867301LASN54ALS652JTSNJ54ALS652FKSNJ54ALS652JTSNJ54ALS652W
N1234567
Pin28242424282424
Package TypeFKWJTJTFKJTW
Industry STD TermLCCCCFPCDIPCDIPLCCCCDIPCFP
JEDEC CodeS-CQCC-NR-GDFP-FR-GDIP-TR-GDIP-TS-CQCC-NR-GDIP-TR-GDFP-F
Package QTY11111
CarrierTUBETUBETUBETUBETUBE
Width (mm)11.439.096.926.9211.436.929.09
Length (mm)11.4314.36323211.433214.36
Thickness (mm)1.831.724.74.71.834.71.72
Pitch (mm)1.271.272.542.541.272.541.27
Max Height (mm)2.032.295.085.082.035.082.29
Mechanical DataDescargarDescargarDescargarDescargarDescargarDescargarDescargar
Device MarkingSN54ALS652JT652FK5962-8867301LA

Paramétricos

Parameters / Models5962-88673013A
5962-88673013A
5962-8867301KA
5962-8867301KA
5962-8867301LA
5962-8867301LA
SN54ALS652JT
SN54ALS652JT
SNJ54ALS652FK
SNJ54ALS652FK
SNJ54ALS652JT
SNJ54ALS652JT
SNJ54ALS652W
SNJ54ALS652W
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125
Operating Temperature Range(C)-55 to 125-55 to 125
Package GroupLCCCCDIP
LCCC
CDIPCDIPLCCCCDIPCDIP
LCCC
Package Size: mm2:W x L, PKG28LCCC: 131 mm2: 11.43 x 11.43(LCCC)See datasheet (CDIP)See datasheet (CDIP)28LCCC: 131 mm2: 11.43 x 11.43(LCCC)See datasheet (CDIP)
Package Size: mm2:W x L (PKG)See datasheet (CFP)
See datasheet (CDIP)
See datasheet (CFP)
See datasheet (CDIP)
RatingMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNoNoNoNo
Technology FamilyALSALSALSALSALSALSALS

Plan ecológico

5962-88673013A5962-8867301KA5962-8867301LASN54ALS652JTSNJ54ALS652FKSNJ54ALS652JTSNJ54ALS652W
RoHSSee ti.comDesobedienteSee ti.comSee ti.comSee ti.comSee ti.comDesobediente
Pb gratisNoNo

Notas de aplicación

  • Advanced Schottky (ALS and AS) Logic Families
    PDF, 1.9 Mb, Archivo publicado: agosto 1, 1995
    This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, Archivo publicado: oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, Archivo publicado: agosto 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Live Insertion
    PDF, 150 Kb, Archivo publicado: oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, Revisión: A, Archivo publicado: agosto 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Shelf-Life Evaluation of Lead-Free Component Finishes
    PDF, 1.3 Mb, Archivo publicado: mayo 24, 2004
    The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Archivo publicado: jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, Archivo publicado: abr 30, 2015

Linea modelo

Clasificación del fabricante

  • Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Transceivers