Datasheet Texas Instruments SN54BCT2827A — Ficha de datos

FabricanteTexas Instruments
SerieSN54BCT2827A
Datasheet Texas Instruments SN54BCT2827A

Memoria intermedia / controlador de 10 bits con resistencia en serie

Hojas de datos

Datasheet

Precios

Estado

5962-9074401M3A5962-9074401MLASNJ54BCT2827AFKSNJ54BCT2827AJT
Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNoNoNoNo

Embalaje

5962-9074401M3A5962-9074401MLASNJ54BCT2827AFKSNJ54BCT2827AJT
N1234
Pin28242824
Package TypeFKJTFKJT
Industry STD TermLCCCCDIPLCCCCDIP
JEDEC CodeS-CQCC-NR-GDIP-TS-CQCC-NR-GDIP-T
Package QTY1111
CarrierTUBETUBETUBETUBE
Device MarkingSNJ54BCTSNJ54BCT2827AJ2827AFK5962-9074401ML
Width (mm)11.436.9211.436.92
Length (mm)11.433211.4332
Thickness (mm)1.834.71.834.7
Pitch (mm)1.272.541.272.54
Max Height (mm)2.035.082.035.08
Mechanical DataDescargarDescargarDescargarDescargar

Paramétricos

Parameters / Models5962-9074401M3A
5962-9074401M3A
5962-9074401MLA
5962-9074401MLA
SNJ54BCT2827AFK
SNJ54BCT2827AFK
SNJ54BCT2827AJT
SNJ54BCT2827AJT
Operating Temperature Range(C)-55 to 125-55 to 125-55 to 125-55 to 125
Package GroupLCCCCDIPLCCCCDIP
Package Size: mm2:W x L (PKG)See datasheet (CFP)
See datasheet (CDIP)
See datasheet (CDIP)See datasheet (CFP)
See datasheet (CDIP)
See datasheet (CDIP)
RatingMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNo
Technology FamilyBCTBCTBCTBCT

Plan ecológico

5962-9074401M3A5962-9074401MLASNJ54BCT2827AFKSNJ54BCT2827AJT
RoHSDesobedienteDesobedienteDesobedienteDesobediente
Pb gratisNoNoNoNo

Notas de aplicación

  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, Archivo publicado: oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, Archivo publicado: agosto 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Live Insertion
    PDF, 150 Kb, Archivo publicado: oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, Revisión: A, Archivo publicado: agosto 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Archivo publicado: jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, Archivo publicado: abr 30, 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, Revisión: D, Archivo publicado: jun 23, 2016

Linea modelo

Clasificación del fabricante

  • Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Buffer Drivers