Datasheet Texas Instruments 5962-9172601MLA — Ficha de datos

FabricanteTexas Instruments
SerieSN54BCT8244A
Numero de parte5962-9172601MLA
Datasheet Texas Instruments 5962-9172601MLA

Dispositivos de prueba de escaneo con tampones octales 24-CDIP -55 a 125

Hojas de datos

Scan Test Devices With Octal Buffers datasheet
PDF, 385 Kb, Revisión: E, Archivo publicado: jul 1, 1996
Extracto del documento

Precios

Estado

Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNo

Embalaje

Pin24
Package TypeJT
Industry STD TermCDIP
JEDEC CodeR-GDIP-T
Package QTY1
CarrierTUBE
Width (mm)6.92
Length (mm)32
Thickness (mm)4.7
Pitch (mm)2.54
Max Height (mm)5.08
Mechanical DataDescargar

Paramétricos

Bits8
ICC @ Nom Voltage(Max)52 mA
Input TypeTTL
Operating Temperature Range-55 to 125 C
Output Drive (IOL/IOH)(Max)64/-15 mA
Output TypeTTL
Package GroupCDIP
Package Size: mm2:W x LSee datasheet (CDIP) PKG
RatingMilitary
Technology FamilyBCT
VCC(Max)5.5 V
VCC(Min)4.5 V
tpd @ Nom Voltage(Max)8.5 ns

Plan ecológico

RoHSSee ti.com

Notas de aplicación

  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, Revisión: A, Archivo publicado: agosto 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Archivo publicado: jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Introduction to Logic
    PDF, 93 Kb, Archivo publicado: abr 30, 2015
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
  • Live Insertion
    PDF, 150 Kb, Archivo publicado: oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, Archivo publicado: oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, Revisión: D, Archivo publicado: jun 23, 2016
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, Archivo publicado: agosto 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con

Linea modelo

Clasificación del fabricante

  • Semiconductors > Space & High Reliability > Logic Products > Specialty Logic Products > Boundary Scan (JTAG)

Otros nombres:

59629172601MLA, 5962 9172601MLA