Package Intersil W9x9.62 — Ficha de datos

FabricanteIntersil
SerieWLCSP
Numero de parteW9x9.62
Package Intersil W9x9.62

9x9 Array 62 Bolas con 0.40 Pitch Wafer Level Chip Scale Package

Package Outline Drawing (POD)

PDF, 157 Kb
Extracto del documento

Paramétricos

FamilyWLCSP-BP
Pin Count62
Length3.69 mm
Width3.69 mm
Height max0.02 mm
Weight0.010258257 g
Pitch0.02 mm
Lead Free Peak Temperature260 °C
Package IndexW9X9.62

Linea modelo

Clasificación del fabricante

  • Plastic Packages