Datasheet ADA4099-1 (Analog Devices) - 4

FabricanteAnalog Devices
Descripción50 V, 8 MHz, 1.5 mA, Robust, Over-The-Top Precision Op Amp
Páginas / Página26 / 4 — ADA4099-1. Preliminary Technical Data. B Grade. H-Grade. Parameter Test. …
RevisiónPrA
Formato / tamaño de archivoPDF / 577 Kb
Idioma del documentoInglés

ADA4099-1. Preliminary Technical Data. B Grade. H-Grade. Parameter Test. Conditions/Comments. Min. Typ Max. Unit

ADA4099-1 Preliminary Technical Data B Grade H-Grade Parameter Test Conditions/Comments Min Typ Max Unit

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ADA4099-1 Preliminary Technical Data B Grade H-Grade Parameter Test Conditions/Comments Min Typ Max Min Typ Max Unit
INPUT CHARACTERISTICS Input Resistance Differential mode 100 100 kΩ Common mode >1 >1 GΩ Over-The-Top Differential mode, VCM > 5 V 600 600 Ω Common mode, VCM > 5 V >100 >100 MΩ Input Capacitance Differential mode 9 9 pF Common mode 3 3 pF SHDN PIN Input Logic Low Amplifier active, SHDN pin voltage −VS + 0.5 −VS + 0.5 V (VSHDN) < −VS + 0.5 V, TMIN < TA < TMAX Input Logic High Amplifier shutdown, VSHDN > −VS + 1.5 −VS + 1.5 V −VS + 1.5 V, TMIN < TA < TMAX Response Time Amplifier active to shutdown 2.5 2.5 μs Amplifier shutdown to active 10 10 μs Pull-Down Current VSHDN = −VS + 0.5 V, TMIN < TA < TMAX 0.6 3 0.6 3 μA VSHDN = −VS + 1.5 V, TMIN < TA < TMAX 0.3 2.5 0.3 2.5 μA OUTPUT CHARACTERISTICS Output Voltage Swing Low Overdrive voltage (V 4 OD ) = 30 mV, no 45 55 45 55 mV load TMIN < TA < TMAX 105 120 mV VOD = 30 mV, sink current, (ISINK) = 10 mA 260 325 260 325 mV TMIN < TA < TMAX 435 450 mV Output Voltage Swing High VOD = 30 mV, no load 45 55 45 55 mV TMIN < TA < TMAX 110 140 mV VOD = 30 mV, source current, 900 1100 900 1100 mV (ISOURCE) = 10 mA TMIN < TA < TMAX 1500 1650 mV Short-Circuit Current ISOURCE 20 30 20 30 mA TMIN< TA < TMAX 15 15 mA ISINK 40 50 40 50 mA TMIN < TA < TMAX 20 20 mA Output Pin Leakage During VSHDN = −VS + 1.5 V ±5 ±100 ±5 ±100 nA Shutdown TMIN < TA < TMAX ±10 ±10 μA POWER SUPPLY Maximum Operating Voltage5 50 50 V Operating Range Guaranteed by power supply 3.15 50 3.15 50 V rejection ratio (PSRR) Supply Current Amplifier active 1.5 1.6 1.5 1.6 mA TMIN < TA < TMAX 2.2 2.35 mA Amplifier shutdown VSHDN = −VS + 1.5 V 12 20 12 20 μA TMIN < TA < TMAX 22.5 22.5 μA PSRR VSY = 3.15 V to ±25 V 126 136 126 136 dB TMIN < TA < TMAX 122 120 dB THERMAL SHUTDOWN6 Temperature Junction temperature (TJ) 175 175 °C Hysteresis 20 20 °C Operating Temperature Ambient temperature (TA) −40 +125 −55 +150 °C 1 Thermoelectric voltages present in the high speed production test limit the measurement accuracy of this parameter. The limits shown in Table 1 are determined by test capability and are not necessarily indicative of actual device performance. 2 Offset voltage drift is guaranteed through lab characterization and is not production tested. 3 Test accuracy is limited by high speed production test equipment repeatability. Bench measurements indicate that the input offset current in Over-The-Top configuration is typically controlled to under 250 nA at +25°C and 1000 nA over the −55°C < TA < +150°C temperature range. 4 VOD is +30 mV for VOUT high and −30 mV for VOUT low. 5 Maximum operating voltage is limited by the time-dependent dielectric breakdown (TDDB) of on-chip capacitor oxides. The amplifier tolerates temporary transient overshoot up to the specified absolute maximum rating, but the dc supply voltage must be limited to the maximum operating voltage. 6 Thermal shutdown is lab characterized only and is not tested in production. Rev. PrA | Page 4 of 26 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS SPECIFICATIONS 5 V SUPPLY ±15 V SUPPLY ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INPUT PROTECTION OVER-THE-TOP OPERATION CONSIDERATIONS OUTPUT SHUTDOWN PIN (SHDN) APPLICATIONS INFORMATION LARGE RESISTOR GAIN OPERATION RECOMMENDED VALUES FOR VARIOUS GAINS NOISE DISTORTION POWER DISSIPATION AND THERMAL SHUTDOWN CIRCUIT LAYOUT CONSIDERATIONS POWER SUPPLY BYPASSING GROUNDING ESD PROTECTION WHEN POWERED RELATED PRODUCTS TYPICAL APPLICATIONS OUTLINE DIMENSIONS