Datasheet ADA4861-3 (Analog Devices) - 5

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ADA4861-3 ABSOLUTE MAXIMUM RATINGS Table 3.
The power dissipated in the package (PD) is the sum of the
Parameter Rating
quiescent power dissipation and the power dissipated in the die Supply Voltage 12.6 V due to the amplifiers’ drive at the output. The quiescent power Power Dissipation See Figure 3 is the voltage between the supply pins (VS) times the quiescent Common-Mode Input Voltage −VS + 1 V to +VS − 1 V current (IS). Differential Input Voltage ±VS PD = Quiescent Power + (Total Drive Power − Load Power) Storage Temperature −65°C to +125°C Operating Temperature Range −40°C to +105°C ⎛ V V ⎞ V 2 = × + ⎜ × ⎟ D P ( S V IS ) S OUT OUT – Lead Temperature JEDEC J-STD-20 ⎝ 2 RL ⎠ RL Junction Temperature 150°C RMS output voltages should be considered. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress Airflow increases heat dissipation, effectively reducing θJA. rating only; functional operation of the device at these or any In addition, more metal directly in contact with the package other conditions above those indicated in the operational leads and through holes under the device reduces θJA. section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect Figure 3 shows the maximum safe power dissipation in the device reliability. package vs. the ambient temperature for the 14-lead SOIC_N (90°C/W) on a JEDEC standard 4-layer board. θJA values are
THERMAL RESISTANCE
approximations. θJA is specified for the worst-case conditions, that is, θJA is
2.5
specified for device soldered in circuit board for surface-mount packages.
) W 2.0 N ( Table 4. Thermal Resistance IO AT Package Type θJA Unit IP S S 1.5
14-lead SOIC_N 90 °C/W
R DI E W O 1.0 Maximum Power Dissipation P UM
The maximum safe power dissipation for the ADA4861-3 is
IM
limited by the associated rise in junction temperature (TJ) on
AX 0.5 M
2 the die. At approximately 150°C, which is the glass transition 00 8- 70 temperature, the plastic changes its properties. Even temporarily
0
05
–55 –45 –35 –25 –15 –5 5 15 25 35 45 55 65 75 85 95 105 115 125
exceeding this temperature limit can change the stresses that the
AMBIENT TEMPERATURE (
°
C)
package exerts on the die, permanently shifting the parametric performance of the amplifiers. Exceeding a junction temperature of Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board 150°C for an extended period can result in changes in silicon devices, potentially causing degradation or loss of functionality.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS PIN CONFIGURATION GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS GAIN CONFIGURATIONS 20 MHz ACTIVE LOW-PASS FILTER RGB VIDEO DRIVER DRIVING TWO VIDEO LOADS POWER-DOWN PINS SINGLE-SUPPLY OPERATION POWER SUPPLY BYPASSING LAYOUT OUTLINE DIMENSIONS ORDERING GUIDE