Datasheet ADA4177-2CHIPS (Analog Devices) - 7
| Fabricante | Analog Devices |
| Descripción | OVP and EMI Protected, Precision, Low Noise and Low Bias Current Op Amp |
| Páginas / Página | 7 / 7 — Data Sheet. ADA4177-2CHIPS. OUTLINE DIMENSIONS. 1.450. 0.625. 0.600. … |
| Formato / tamaño de archivo | PDF / 156 Kb |
| Idioma del documento | Inglés |
Data Sheet. ADA4177-2CHIPS. OUTLINE DIMENSIONS. 1.450. 0.625. 0.600. 0.3302. 0.510. 0.3048 0.2794. 0.550. 0.522. 0.421. 0.389. 1.300. TOP VIEW
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Data Sheet ADA4177-2CHIPS OUTLINE DIMENSIONS 1.450 0.625 0.600 0.3302 0.600 0.510 0.3048 0.2794 0.550 0.522 0.421 0.522 0.421 0.389 0.389 0.550 1.300 TOP VIEW SIDE VIEW (CIRCUIT SIDE) 0.070 × 0.070 0.520 0.625 B 02 2020- 45 -00 -15- G K P 09
Figure 3. 8-Pad Bare Die [CHIP] (C-8-24)) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Die Specifications Parameter Value Unit
Chip Size 1360 × 1210 μm Scribe Line Width 90 μm Die Size (Maximum) 1450 × 1300 μm Thickness 12 mils Backside Connect to V− Not applicable Passivation Undoped oxide/silicon nitride (SiN) Not applicable Bond Pads (Minimum) 70 × 70 μm Bond Pad Composition Aluminum silicon (AlSi) (1.0%), copper (Cu) (0.5%) % Polyimide Thickness 18 μm Die Marker ID ada4177_2z Not applicable
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach Hitachi EN 4900GC Bonding Method Forward bond Bonding Sequence Lead to bond first = 1
ORDERING GUIDE Model1 Temperature Range Package Description Package Option Ordering Quantity
ADA4177-2CHIPS −40°C to +125°C 8-Pad Bare Die [CHIP] C-8-24 400 1 ADA4177-2CHIPS is RoHS compliant.
©2020 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D24846-10/20(0)
Rev. 0 | Page 7 of 7 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS, ±5 V ELECTRICAL CHARACTERISTICS, ±15 V ABSOLUTE MAXIMUM RATINGS ELECTROSTATIC DISCHARGE (ESD) RATINGS ESD Ratings for ADA4177-2CHIPS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
Figure 3. 8-Pad Bare Die [CHIP] (C-8-24)) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Die Specifications Parameter Value Unit
Chip Size 1360 × 1210 μm Scribe Line Width 90 μm Die Size (Maximum) 1450 × 1300 μm Thickness 12 mils Backside Connect to V− Not applicable Passivation Undoped oxide/silicon nitride (SiN) Not applicable Bond Pads (Minimum) 70 × 70 μm Bond Pad Composition Aluminum silicon (AlSi) (1.0%), copper (Cu) (0.5%) % Polyimide Thickness 18 μm Die Marker ID ada4177_2z Not applicable
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach Hitachi EN 4900GC Bonding Method Forward bond Bonding Sequence Lead to bond first = 1
ORDERING GUIDE Model1 Temperature Range Package Description Package Option Ordering Quantity
ADA4177-2CHIPS −40°C to +125°C 8-Pad Bare Die [CHIP] C-8-24 400 1 ADA4177-2CHIPS is RoHS compliant.
©2020 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D24846-10/20(0)
Rev. 0 | Page 7 of 7 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS, ±5 V ELECTRICAL CHARACTERISTICS, ±15 V ABSOLUTE MAXIMUM RATINGS ELECTROSTATIC DISCHARGE (ESD) RATINGS ESD Ratings for ADA4177-2CHIPS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE