Datasheet HMC8205BF10 (Analog Devices) - 4

HMC8205BF10 Data Sheet ABSOLUTE MAXIMUM RATINGS
This device is not surface mountable and is not intended nor
THERMAL RESISTANCE
suitable to be used in a solder reflow process. This device must not be exposed to ambient temperatures above 150°C. Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to
Table 3.
PCB thermal design is required.
Parameter Rating Table 4. Thermal Resistance
Drain Bias Voltage (VDD) 60 V dc
Package Type θ
Gate Bias Voltage (V
JC Unit
GG1)

−8 V to 0 V dc EJ-10-1 1.57 °C/W Radio Frequency (RF) Input Power (RFIN) 35 dBm Continuous Power Dissipation (PDISS) (T = 85°C) 89.4 W
Table 5. Reliability Information
(Derate 636 mw/°C Above 85°C)
Temperature
Storage Temperature Range −55°C to +150°C
Parameter (°C)
Operating Temperature Range −40°C to +85°C Junction Temperature to Maintain 1,000,000 225 Human Body Model (HBM) Electrostatic 375 V Hour Mean Time to Failure (MTTF) Discharge (ESD) Sensitivity Nominal Junction Temperature (T = 85°C, 187 V Stresses at or above those listed under Absolute Maximum DD = 50 V) Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. C | Page 4 of 14 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Application Circuit Evaluation PCB Outline Dimensions Ordering Guide