Datasheet HMC590LP5E (Analog Devices) - 8

HMC590LP5E
v04.1219
GaAs pHEMT MMIC 1 WATT POWER AMPLIFIER, 6.0 - 9.5 GHz Evaluation PCB
T M S - S R IE LIF P M R A E W O R & P A E LIN
List of Materials for Evaluation PCB 115927-HMC590LP5 [1]
The circuit board used in the final application Item Description should use RF circuit design techniques. Signal J1 - J2 PCB Mount SMA Connector lines should have 50 Ohm impedance while the J3 DC Pin package ground leads and package bottom should C1 - C4 100 pF Capacitor, 0402 Pkg be connected directly to the ground plane similar to C5 - C8 2.2 µF Capacitor, 1206 Pkg that shown. A sufficient number of via holes should U1 HMC590LP5E be used to connect the top and bottom ground PCB [2] 109001 Evaluation PCB planes. The evaluation board should be mounted [1] Reference this number when ordering complete evaluation PCB to an appropriate heat sink. The evaluation circuit [2] Circuit Board Material: Rogers 4350 board shown is available from Analog Devices , Inc. upon request. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Broadband Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature P1dB vs. Temperature Psat vs. Temperature P1dB vs. Current Psat vs. Current Output IP3 vs. Temperature 7V @ 520 mA, Pin/Tone = -15 dBm Power Compression @ 8 GHz, 7V @ 820 mA Output IM3, 7V @ 820 mA Gain & Power vs. Supply Current @ 8 GHz Gain & Power vs. Supply Voltage @ 8 GHz Reverse Isolation vs. Temperature, 7V @ 820 mA Power Dissipation Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Package Information Pin Descriptions Application Circuit Evaluation PCB List of Materials for Evaluation PCB 115927