Datasheet OPA4383 (Texas Instruments) - 6

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OPA383, OP A2383, OP A4383
SBOSAK7B – DECEMBER 2024 – REVISED JUNE 2025
www.ti.com 5.4 Thermal Information OPA383 OPA383 THERMAL METRIC
(1)
DBV (SOT-23) UNIT 5 PINS
RθJA Junction-to-ambient thermal resistance 183.4 °C/W RθJC(top) Junction-to-case(top) thermal resistance 110.7 °C/W RθJB Junction-to-board thermal resistance 49.2 °C/W ψJT Junction-to-top characterization parameter 29.5 °C/W ψJB Junction-to-board characterization parameter 49.1 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see theSemiconductor and IC Package Thermal Metricsapplication report.
5.5 Thermal Information OPA2383 OPA2383 THERMAL METRIC
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DGK (VSSOP) UNIT 8 PINS
RθJA Junction-to-ambient thermal resistance 165 °C/W RθJC(top) Junction-to-case (top) thermal resistance 53 °C/W RθJB Junction-to-board thermal resistance 87 °C/W ΨJT Junction-to-top characterization parameter 4.9 °C/W ΨJB Junction-to-board characterization parameter 85 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated Product Folder Links: OPA383 OPA2383 OPA4383 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Pin Configuration and Functions 5 Specifications 5.1 Absolute Maximum Ratings 5.2 ESD Ratings 5.3 Recommended Operating Conditions 5.4 Thermal Information OPA383 5.5 Thermal Information OPA2383 5.6 Electrical Characteristics 5.7 Typical Characteristics 6 Detailed Description 6.1 Overview 6.2 Functional Block Diagram 6.3 Feature Description 6.3.1 Input Bias Current 6.3.2 EMI Susceptibility and Input Filtering 6.4 Device Functional Modes 7 Application and Implementation 7.1 Application Information 7.1.1 Zero-Drift Clocking 7.2 Typical Applications 7.2.1 Bidirectional Current Sensing 7.2.1.1 Design Requirements 7.2.1.2 Detailed Design Procedure 7.2.1.3 Application Curve 7.2.2 Bridge Sensor Measurement 7.3 Power Supply Recommendations 7.4 Layout 7.4.1 Layout Guidelines 7.4.2 Layout Example 8 Device and Documentation Support 8.1 Device Support 8.1.1 Development Support 8.1.1.1 PSpice® for TI 8.1.1.2 TINA-TI™ Simulation Software (Free Download) 8.2 Receiving Notification of Documentation Updates 8.3 Support Resources 8.4 Trademarks 8.5 Electrostatic Discharge Caution 8.6 Glossary 9 Revision History 10 Mechanical, Packaging, and Orderable Information