Datasheet Texas Instruments MSP430FR5736IRGER — Ficha de datos

FabricanteTexas Instruments
SerieMSP430FR5736
Numero de parteMSP430FR5736IRGER
Datasheet Texas Instruments MSP430FR5736IRGER

MSP430FR5736 Microcontrolador ULP de 24 MHz con FRAM de 16 KB, SRAM de 1 KB, 21 IO y comparador 24-VQFN -40 a 85

Hojas de datos

MSP430FR573x Mixed-Signal Microcontrollers datasheet
PDF, 2.3 Mb, Revisión: K, Archivo publicado: abr 25, 2016
Extracto del documento

Precios

Estado

Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNo

Embalaje

Pin2424
Package TypeRGERGE
Industry STD TermVQFNVQFN
JEDEC CodeS-PQFP-NS-PQFP-N
Package QTY30003000
CarrierLARGE T&RLARGE T&R
Device Marking5736430FR
Width (mm)44
Length (mm)44
Thickness (mm).88.88
Pitch (mm).5.5
Max Height (mm)11
Mechanical DataDescargarDescargar

Paramétricos

ADCSlope
AESN/A
Active Power91.667 uA/MHz
Additional FeaturesReal-Time Clock,Watchdog,Brown Out Reset,IrDA
BSLUART
CPUMSP430
Comparators12
DMA3
Featuredfr5
Frequency24 MHz
GPIO Pins21
I2C1
Max VCC3.6
Min VCC2
Multiplier32x32
Non-volatile Memory16 KB
Operating Temperature Range-40 to 85 C
Package GroupVQFN
Package Size: mm2:W x L24VQFN: 16 mm2: 4 x 4(VQFN) PKG
RAM1 KB
RatingCatalog
SPI2
Security EnablerCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection
Special I/ON/A
Standby Power6.4 LPM3-uA
Timers - 16-bit3
UART1
Wakeup Time78 us

Plan ecológico

RoHSObediente

Kits de diseño y Módulos de evaluación

  • Evaluation Modules & Boards: MSP-TS430RHA40A
    MSP-TS430RHA40A- 40-pin Target Development Board for MSP430FRxx FRAM MCUs
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • Evaluation Modules & Boards: MSP-FET430U40A
    40-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F5x MCUs
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • JTAG Emulators/ Analyzers: ENERGYTRACE
    MSP EnergyTrace Technology
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)

Notas de aplicación

  • Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)
    PDF, 3.5 Mb, Revisión: A, Archivo publicado: marzo 2, 2015
  • MSP430 System-Level ESD Considerations
    PDF, 1.5 Mb, Archivo publicado: marzo 29, 2012
    System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs:(1) Component-level ESD testing and system-level ESD testing, their differ
  • Maximizing Write Speed on the MSP430в„ў FRAM (Rev. B)
    PDF, 103 Kb, Revisión: B, Archivo publicado: feb 4, 2015
    Nonvolatile low-power ferroelectric RAM (FRAM) is capable of extremely high-speed write accesses. This application report discusses how to maximize FRAM write speeds specifically in the MSP430FRxx family using simple techniques. The document uses examples from bench tests performed on the MSP430FR5739 device, which can be extended to all MSP430в„ў FRAM-based devices, and discusses tradeoffs such as
  • MSP430 FRAM Technology – How To and Best Practices
    PDF, 326 Kb, Archivo publicado: jun 23, 2014
    FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif
  • MSP430 FRAM Quality and Reliability (Rev. A)
    PDF, 295 Kb, Revisión: A, Archivo publicado: mayo 1, 2014
    FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura
  • Migrating from the USCI Module to the eUSCI Module (Rev. A)
    PDF, 41 Kb, Revisión: A, Archivo publicado: sept 13, 2012
    The purpose of this application report is to enable easy migration for designs based on the USCI_A and USCI_B modules to the eUSCI_A and the eUSCI_B modules. The document highlights the new features in the eUSCI module and the main differences between the USCI and the eUSCI modules.
  • Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)
    PDF, 154 Kb, Revisión: A, Archivo publicado: feb 16, 2012
    This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families. For more information on the usage of the MSP430FR57xx features, see the MSP430FR57xx Family User's Guide (

Linea modelo

Clasificación del fabricante

  • Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430FRxx FRAM