Datasheet Texas Instruments LM3691TLX-1.5/NOPB — Ficha de datos

FabricanteTexas Instruments
SerieLM3691
Numero de parteLM3691TLX-1.5/NOPB
Datasheet Texas Instruments LM3691TLX-1.5/NOPB

Convertidor CC-CC reductor de baja precisión, miniatura 1A de alta precisión para aplicaciones portátiles 6-DSBGA -30 a 85

Hojas de datos

LM3691 High-Accuracy, Miniature 1-A Step-Down DC-DC Converter for Portable Applications datasheet
PDF, 2.9 Mb, Revisión: J, Archivo publicado: dic 17, 2015
Extracto del documento

Precios

Estado

Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNo

Embalaje

Pin6
Package TypeYZR
Industry STD TermDSBGA
JEDEC CodeR-XBGA-N
Package QTY3000
CarrierLARGE T&R
Device MarkingY
Width (mm)1.3
Length (mm)1.5
Thickness (mm).675
Pitch (mm).5
Max Height (mm).675
Mechanical DataDescargar

Paramétricos

Control ModeVoltage Mode
Duty Cycle(Max)100 %
Iout(Max)1 A
Iq(Typ)0.064 mA
Operating Temperature Range-30 to 85 C
Package GroupDSBGA
RatingCatalog
Regulated Outputs1
Special FeaturesEnable,Light Load Efficiency,Synchronous Rectification
Switching Frequency(Max)4400 kHz
Switching Frequency(Min)3600 kHz
TypeConverter
Vin(Max)5.5 V
Vin(Min)2.3 V
Vout(Max)3.3 V
Vout(Min)0.75 V

Plan ecológico

RoHSObediente

Kits de diseño y Módulos de evaluación

  • Evaluation Modules & Boards: LM3691TL-1.2EV
    LM3691TL-1.2 Evaluation Board
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • Evaluation Modules & Boards: LM3691TL-1.8EV
    LM3691TL-1.8 Evaluation Board
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)

Notas de aplicación

  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Kb, Revisión: B, Archivo publicado: mayo 3, 2004
    Application Note 643 EMI/RFI Board Design
  • Input and Output Capacitor Selection
    PDF, 219 Kb, Archivo publicado: sept 19, 2005
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Mb, Revisión: A, Archivo publicado: abr 23, 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
    PDF, 1.4 Mb, Revisión: A, Archivo publicado: abr 23, 2013
    This application note provides thermal power analysis techniques for analyzing the power IC.
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Mb, Revisión: A, Archivo publicado: abr 23, 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, Revisión: C, Archivo publicado: abr 19, 2016
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Kb, Revisión: C, Archivo publicado: abr 23, 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Kb, Revisión: C, Archivo publicado: abr 23, 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Mb, Revisión: C, Archivo publicado: abr 24, 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Mb, Revisión: B, Archivo publicado: abr 23, 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Linea modelo

Clasificación del fabricante

  • Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)

Otros nombres:

LM3691TLX1.5/NOPB, LM3691TLX 1.5/NOPB