Datasheet Texas Instruments SN74CBTLV3253DE4 — Ficha de datos

FabricanteTexas Instruments
SerieSN74CBTLV3253
Numero de parteSN74CBTLV3253DE4
Datasheet Texas Instruments SN74CBTLV3253DE4

Multiplexor / demultiplexor dual de baja tensión 1-de-4 FET 16-SOIC -40 a 85

Hojas de datos

SN74CBTLV3253 Low-Voltage Dual 1-of-4 FET Multiplexer/Demultiplexer datasheet
PDF, 1.5 Mb, Revisión: I, Archivo publicado: sept 30, 2015
Extracto del documento

Precios

Estado

Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNo

Embalaje

Pin16
Package TypeD
Industry STD TermSOIC
JEDEC CodeR-PDSO-G
Package QTY40
CarrierTUBE
Device MarkingCBTLV3253
Width (mm)3.91
Length (mm)9.9
Thickness (mm)1.58
Pitch (mm)1.27
Max Height (mm)1.75
Mechanical DataDescargar

Paramétricos

Additional FeaturesPowered off protection
Bandwidth200 MHz
Bandwidth(Max)200 MHz
Configuration4:1
ESD Charged Device Model1 kV
ESD HBM2 kV
Input/Ouput Voltage(Max)3.6 V
Input/Output Continuous Current(Max)128 mA
Input/Output OFF-state Capacitance(Typ)5.5 pF
Number of Channels2
OFF-state leakage current(Max)1 µA
ON-state leakage current(Max)1 µA
Operating Temperature Range-40 to 85 C
Package GroupSOIC
Package Size: mm2:W x L16SOIC: 59 mm2: 6 x 9.9(SOIC) PKG
RatingCatalog
Ron(Max)40 Ohms
Ron(Typ)5 Ohms
Supply Current(Max)10 uA
Supply Range3.6 Max
VIH(Min)2 V
VIL(Max)0.8 V
Vdd(Max)3.6 V
Vdd(Min)2.3 V
Vss(Max)N/A V
Vss(Min)N/A V

Plan ecológico

RoHSObediente

Kits de diseño y Módulos de evaluación

  • Evaluation Modules & Boards: EVMX777BG-01-00-00
    J6Entry, RSP and TDA2E-17 CPU Board Evaluation Module
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • Evaluation Modules & Boards: EVMX777G-01-20-00
    J6Entry/RSP Infotainment (CPU+Display+JAMR3) Evaluation Module
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)

Notas de aplicación

  • VOLTAGE LEVEL TRANSLATION (SL) - Family
    PDF, 111 Kb, Archivo publicado: sept 21, 2011
  • Bus FET Switch Solutions for Live Insertion Applications
    PDF, 300 Kb, Archivo publicado: feb 7, 2003
    In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ

Linea modelo

Clasificación del fabricante

  • Semiconductors > Switches and Multiplexers > Analog Switches/Muxes