PDF, 1.4 Mb, Archivo publicado: marzo 1, 1988
Extracto del documento
PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking
(4/5) 5962-8762101EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101EA
SNJ54LS592J 5962-8762101FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101FA
SNJ54LS592W 5962-8762101FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101FA
SNJ54LS592W SN54LS592J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS592J SN54LS592J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS592J SN54LS593J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS593J SN54LS593J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS593J SN74LS592D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592 SN74LS592D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592 SN74LS592DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592 SN74LS592DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592 SN74LS592DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592 SN74LS592DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592 SN74LS592N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS592N SN74LS592N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS592N SN74LS592NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS592 SN74LS592NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS592 SN74LS593DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking …
