Datasheet Texas Instruments TMS320C6652CZHA6 — Ficha de datos

Fabricante	Texas Instruments
Serie	TMS320C6652
Numero de parte	TMS320C6652CZHA6

Hojas de datos

Notas de aplicación

• Descargar
  TMS320C66x DSP Generation of Devices (Rev. A)
  PDF, 245 Kb, Revisión: A, Archivo publicado: abr 25, 2011
• Descargar
  Hardware Design Guide for KeyStone Devices (Rev. C)
  PDF, 1.7 Mb, Revisión: C, Archivo publicado: sept 15, 2013
• Descargar
  KeyStone I DDR3 Initialization (Rev. E)
  PDF, 114 Kb, Revisión: E, Archivo publicado: oct 28, 2016
  The initialization of the DDR3 DRAM controller on KeyStone I DSPs is straightforward as long as the proper steps are followed. However, if some steps are omitted or if some sequence-sensitive steps are implemented in the wrong order, DDR3 operation will be unpredictable.All DDR3 initialization routines must contain the basic register writes to configure the memory controller within the DSP
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  AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
  PDF, 2.2 Mb, Revisión: A, Archivo publicado: mayo 1, 2004
  Application Note 1281 Bumped Die (Flip Chip) Packages
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  The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
  PDF, 20 Kb, Revisión: A, Archivo publicado: nov 10, 2010
  The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
• Descargar
  Clocking Design Guide for KeyStone Devices
  PDF, 1.5 Mb, Archivo publicado: nov 9, 2010
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  Optimizing Loops on the C66x DSP
  PDF, 585 Kb, Archivo publicado: nov 9, 2010
• Descargar
  DDR3 Design Requirements for KeyStone Devices (Rev. B)
  PDF, 582 Kb, Revisión: B, Archivo publicado: jun 5, 2014
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  TI DSP Benchmarking
  PDF, 62 Kb, Archivo publicado: enero 13, 2016
  This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
• Descargar
  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Mb, Revisión: B, Archivo publicado: agosto 13, 2015

Linea modelo

Clasificación del fabricante

• Semiconductors > Processors > Digital Signal Processors > C6000 DSP > C66x DSP