Datasheet Texas Instruments 5962-9758601QSA — Ficha de datos

FabricanteTexas Instruments
SerieSN54F244
Numero de parte5962-9758601QSA
Datasheet Texas Instruments 5962-9758601QSA

Buffers / controladores octales con salidas de 3 estados 20-CFP -55 a 125

Hojas de datos

Octal Buffers/Drivers With 3-State Outputs datasheet
PDF, 1.3 Mb, Revisión: A, Archivo publicado: oct 1, 1993
Extracto del documento

Precios

Estado

Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNo

Embalaje

Pin202020
Package TypeWWW
Industry STD TermCFPCFPCFP
JEDEC CodeR-GDFP-FR-GDFP-FR-GDFP-F
Package QTY111
CarrierTUBETUBETUBE
Device Marking5962-9758601QSASNJ54F244W
Width (mm)6.926.926.92
Length (mm)13.0913.0913.09
Thickness (mm)1.841.841.84
Pitch (mm)1.271.271.27
Max Height (mm)2.452.452.45
Mechanical DataDescargarDescargarDescargar

Paramétricos

Bits8
Input TypeTTL
Operating Temperature Range-55 to 125 C
Output TypeTTL
Package GroupCFP
Package Size: mm2:W x LSee datasheet (CFP) PKG
RatingMilitary
Schmitt TriggerNo
Technology FamilyF
VCC(Max)5.5 V
VCC(Min)4.5 V
Voltage(Nom)5 V

Plan ecológico

RoHSSee ti.com

Notas de aplicación

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  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, Archivo publicado: agosto 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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    PDF, 105 Kb, Revisión: A, Archivo publicado: agosto 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
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  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Archivo publicado: jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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    PDF, 93 Kb, Archivo publicado: abr 30, 2015

Linea modelo

Clasificación del fabricante

  • Semiconductors > Space & High Reliability > Logic Products > Buffers/Drivers/Transceivers > Buffer Drivers

Otros nombres:

59629758601QSA, 5962 9758601QSA