Datasheet Texas Instruments 74AC11240DBRG4 — Ficha de datos

FabricanteTexas Instruments
Serie74AC11240
Numero de parte74AC11240DBRG4
Datasheet Texas Instruments 74AC11240DBRG4

Octal Buffers / Drivers 24-SSOP -40 a 85

Hojas de datos

Octal Buffer/Line Driver With 3-State Outputs datasheet
PDF, 573 Kb, Revisión: A, Archivo publicado: abr 1, 1996
Extracto del documento

Precios

Estado

Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNo

Embalaje

Pin24
Package TypeDB
Industry STD TermSSOP
JEDEC CodeR-PDSO-G
Package QTY2000
CarrierLARGE T&R
Device MarkingAE240
Width (mm)5.3
Length (mm)8.2
Thickness (mm)1.95
Pitch (mm).65
Max Height (mm)2
Mechanical DataDescargar

Paramétricos

Bits8
F @ Nom Voltage(Max)100 Mhz
ICC @ Nom Voltage(Max)0.08 mA
Operating Temperature Range-40 to 85 C
Output Drive (IOL/IOH)(Max)-24/24 mA
Package GroupSSOP
Package Size: mm2:W x L24SSOP: 64 mm2: 7.8 x 8.2(SSOP) PKG
RatingCatalog
Schmitt TriggerNo
Technology FamilyAC
VCC(Max)5.5 V
VCC(Min)3 V
Voltage(Nom)3.3,5 V
tpd @ Nom Voltage(Max)11.7,8.4 ns

Plan ecológico

RoHSObediente

Notas de aplicación

  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, Archivo publicado: agosto 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Archivo publicado: jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Introduction to Logic
    PDF, 93 Kb, Archivo publicado: abr 30, 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, Revisión: D, Archivo publicado: jun 23, 2016
  • Live Insertion
    PDF, 150 Kb, Archivo publicado: oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, Revisión: B, Archivo publicado: jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, Archivo publicado: oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Kb, Archivo publicado: abr 1, 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

Linea modelo

Clasificación del fabricante

  • Semiconductors > Logic > Buffer/Driver/Transceiver > Inverting Buffer/Driver