Datasheet Texas Instruments ISO7310FCQDQ1 — Ficha de datos

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Shelf-Life Evaluation of Lead-Free Component Finishes
PDF, 1.3 Mb, Archivo publicado: mayo 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a
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Isolation Glossary
PDF, 52 Kb, Archivo publicado: oct 27, 2014
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Digital Isolator Design Guide (Rev. A)
PDF, 487 Kb, Revisión: A, Archivo publicado: nov 4, 2014

Serie: ISO7310-Q1 (4)