Datasheet Texas Instruments SN74AVC16244DGGR — Ficha de datos

Fabricante	Texas Instruments
Serie	SN74AVC16244
Numero de parte	SN74AVC16244DGGR

Hojas de datos

Notas de aplicación

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  Simultaneous-Switching Performance of TI Logic Devices (Rev. B)
  PDF, 378 Kb, Revisión: B, Archivo publicado: feb 23, 2005
  Simultaneous-switching noise can generate and propagate glitches in electronic systems. Therefore, system designers are faced with challenges to minimize simultaneous-switching noise, while increasing switching speed and improving signal quality. This report presents the performance of different TI logic devices under various simultaneous-switching conditions. Factors such as the number of bits sw
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  Dynamic Output Control (DOC) Circuitry Technology And Applications (Rev. B)
  PDF, 126 Kb, Revisión: B, Archivo publicado: jul 7, 1999
  Texas Instruments (TI[TM]) next-generation logic is called the Advanced Very-low-voltage CMOS (AVC) family. The AVCfamily features TI?s Dynamic Output Control (DOC[TM]) circuit (patent pending). DOC circuitry automatically lowers the outputimpedance of the circuit at the beginning of a signal transition, providing enough current to achieve high signaling speeds, thensubsequently raises the i
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  AVC Logic Family Technology and Applications (Rev. A)
  PDF, 148 Kb, Revisión: A, Archivo publicado: agosto 26, 1998
  Texas Instruments (TI?) announces the industry?s first logic family to achieve maximum propagation delays of less than 2 ns at 2.5 V. TI?s next-generation logic is the Advanced Very-low-voltage CMOS (AVC) family. Although optimized for 2.5-V systems, AVC logic supports mixed-voltage systems because it is compatible with 3.3-V and 1.8-V devices. The AVC family features TI?s Dynamic Output Control (
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  Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B)
  PDF, 390 Kb, Revisión: B, Archivo publicado: abr 30, 2015
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  16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
  PDF, 895 Kb, Revisión: B, Archivo publicado: mayo 22, 2002
  TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa

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Clasificación del fabricante

• Semiconductors > Logic > Buffer/Driver/Transceiver > Non-Inverting Buffer/Driver