This device is designed specifically to power IMVP Mobile Processors under a strict disclosure
agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For
more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins
Type Drawing TPS51610IRHBR VQFN RHB 32 TPS51610IRHBT VQFN RHB TPS51610RHBR VQFN RHB TPS51610RHBT VQFN RHB SPQ Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm) B0
(mm) K0
(mm) P1
(mm) W
Pin1
(mm) Quadrant 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jul-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS51610IRHBR VQFN RHB 32 3000 367.0 367.0 35.0 TPS51610IRHBT VQFN RHB 32 250 210.0 185.0 35.0 TPS51610RHBR VQFN RHB 32 3000 367.0 367.0 35.0 TPS51610RHBT VQFN RHB 32 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily …
