Datasheet Texas Instruments X66AK2E05XABD25 — Ficha de datos

FabricanteTexas Instruments
Serie66AK2E05
Numero de parteX66AK2E05XABD25
Datasheet Texas Instruments X66AK2E05XABD25

DSP + ARM multinúcleo KeyStone II System-on-Chip (SoC) 1089-FCBGA 0 a 85

Hojas de datos

66AK2E05/02 Multicore DSP+ARM KeyStone II System-on-Chip (SoC) datasheet
PDF, 2.0 Mb, Revisión: D, Archivo publicado: marzo 11, 2015
Extracto del documento

Precios

Estado

Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNo

Embalaje

Pin10891089
Package TypeABDABD
Device Marking@2012 TIX66AK2E05XABD
Width (mm)2727
Length (mm)2727
Thickness (mm)2.982.98
Mechanical DataDescargarDescargar

Paramétricos

ARM CPU4 ARM Cortex-A15
ARM MHz1250,1400 Max.
ApplicationsAvionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space
DRAMDDR3,DDR3L
DSP1 C66x
DSP MHz1250,1400 Max.
EMAC2-Port 10Gb Switch,8-Port 1Gb Switch
Hardware AcceleratorsSecurity Accelerator,Packet Accelerator
I2C3
On-Chip L2 Cache4096 KB (ARM Cluster),512 KB (per C66x DSP core)
Operating SystemsIntegrity,Linux,SYS/BIOS,VxWorks
Operating Temperature Range0 to 85,-40 to 100 C
Other On-Chip Memory2048 KB
PCI/PCIe4 PCIe Gen2
RatingCatalog
SPI3
UART2 SCI
USB2

Plan ecológico

RoHSDesobediente

Kits de diseño y Módulos de evaluación

  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • Evaluation Modules & Boards: EVMK2EX
    K2E Development Board
    Estado del ciclo de vida: Vista previa (El dispositivo ha sido anunciado pero no está en producción. Las muestras pueden o no estar disponibles)
  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • Evaluation Modules & Boards: XEVMK2EX
    K2E Development Board
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)

Notas de aplicación

  • Power Consumption Summary for K2E System-on-Chip (SoC) Device Family
    PDF, 65 Kb, Archivo publicado: jun 14, 2017
    This application report discusses estimating the power consumption of Texas Instruments' K2Ex Digital Signal Processors (DSP) using a provided device-specific power spreadsheet. It should be noted that the power model is applicable for all silicon revisions.
  • Clocking Spreadsheet for K2E Device Family
    PDF, 22 Kb, Archivo publicado: enero 26, 2017
    This document discusses the internal clocking architecture of Texas Instruments K2Ex Digital Signal Processors (DSP) using a provided clocking spreadsheet.The 66AK2Ex and AM5K2Ex devices have similar internal clocking architecture and peripherals except the corepac. The 66AK2Ex devices have both DSP corepac and ARM corepac, whereas, the AM5K2Ex devices have ARM corepac only.Use the K
  • PCI Express (PCIe) Resource Wiki for Keystone Devices (Rev. A)
    PDF, 57 Kb, Revisión: A, Archivo publicado: mayo 19, 2017
  • Keystone II DDR3 Initialization
    PDF, 73 Kb, Archivo publicado: enero 26, 2015
    This application report provides a step-to-step initialization guide for the Keystone II device DDR3 SDRAM controller.
  • Throughput Performance Guide for KeyStone II Devices (Rev. B)
    PDF, 866 Kb, Revisión: B, Archivo publicado: dic 22, 2015
    This application report analyzes various performance measurements of the KeyStone II family of processors. It provides a throughput analysis of the various support peripherals to different end-points and memory access.
  • Keystone II DDR3 Debug Guide
    PDF, 143 Kb, Archivo publicado: oct 16, 2015
    This guide provides tools for use when debugging a failing DDR3 interface on a KeyStone II device.
  • Power Management of KS2 Device (Rev. C)
    PDF, 61 Kb, Revisión: C, Archivo publicado: jul 15, 2016
    This application report lists the steps to enable Class 0 Temperature Compensation (Class 0 TC) mode of SmartReflexв„ў Subsystem (SRSS) module available on such devices.
  • Hardware Design Guide for KeyStone II Devices
    PDF, 1.8 Mb, Archivo publicado: marzo 24, 2014
  • SERDES Link Commissioning on KeyStone I and II Devices
    PDF, 138 Kb, Archivo publicado: abr 13, 2016
    The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
  • PCIe Use Cases for KeyStone Devices
    PDF, 320 Kb, Archivo publicado: dic 13, 2011
  • Clocking Design Guide for KeyStone Devices
    PDF, 1.5 Mb, Archivo publicado: nov 9, 2010
  • The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
    PDF, 20 Kb, Revisión: A, Archivo publicado: nov 10, 2010
    The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
  • Optimizing Loops on the C66x DSP
    PDF, 585 Kb, Archivo publicado: nov 9, 2010
  • DDR3 Design Requirements for KeyStone Devices (Rev. B)
    PDF, 582 Kb, Revisión: B, Archivo publicado: jun 5, 2014
  • Multicore Programming Guide (Rev. B)
    PDF, 1.8 Mb, Revisión: B, Archivo publicado: agosto 29, 2012
    As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore
  • Processor SDK RTOS Audio Benchmark Starter Kit
    PDF, 530 Kb, Archivo publicado: abr 12, 2017
    The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device
  • TI DSP Benchmarking
    PDF, 62 Kb, Archivo publicado: enero 13, 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.

Linea modelo

Clasificación del fabricante

  • Semiconductors > Processors > Digital Signal Processors > C6000 DSP + ARM Processors > 66AK2x