Datasheet Texas Instruments AM3358 — Ficha de datos

FabricanteTexas Instruments
SerieAM3358
Datasheet Texas Instruments AM3358

Procesador Sitara

Hojas de datos

AM335x Sitaraв„ў Processors datasheet
PDF, 3.2 Mb, Revisión: J, Archivo publicado: abr 12, 2016
Extracto del documento

Precios

Estado

AM3358BZCZ100AM3358BZCZ60AM3358BZCZ80AM3358BZCZA100AM3358BZCZA80
Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNoNo

Embalaje

AM3358BZCZ100AM3358BZCZ60AM3358BZCZ80AM3358BZCZA100AM3358BZCZA80
N12345
Pin324324324324324
Package TypeZCZZCZZCZZCZZCZ
Package QTY126126126126126
Device MarkingAM3358BZCZ100AM3358BZCZ60AM3358BZCZ80AM3358BZCZA100AM3358BZCZA80
Width (mm)1515151515
Length (mm)1515151515
Thickness (mm).9.9.9.9.9
Mechanical DataDescargarDescargarDescargarDescargarDescargar

Paramétricos

Parameters / ModelsAM3358BZCZ100
AM3358BZCZ100
AM3358BZCZ60
AM3358BZCZ60
AM3358BZCZ80
AM3358BZCZ80
AM3358BZCZA100
AM3358BZCZA100
AM3358BZCZA80
AM3358BZCZA80
ARM CPU1 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A8
ARM MHz, Max.600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000
ApplicationsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal Electronics
Co-Processor, s2 PRU-ICSS2 PRU-ICSS2 PRU-ICSS2 PRU-ICSS2 PRU-ICSS
DMIPS1200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,2000
DRAMDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDR
Display Outputs11111
EMAC2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch
Graphics Acceleration1 3D1 3D1 3D1 3D1 3D
Industrial Protocols1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III
On-Chip L2 Cache256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)
Operating SystemsAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE
Operating Temperature Range, C-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90
Other On-Chip Memory128 KB128 KB128 KB128 KB128 KB
RatingCatalogCatalogCatalogCatalogCatalog
Security EnablerCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment
Serial I/OCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USB

Plan ecológico

AM3358BZCZ100AM3358BZCZ60AM3358BZCZ80AM3358BZCZA100AM3358BZCZA80
RoHSObedienteObedienteObedienteObedienteObediente

Notas de aplicación

  • AM335x Low Power Design Guide (Rev. A)
    PDF, 300 Kb, Revisión: A, Archivo publicado: feb 28, 2017
    This document discusses techniques to develop a low power, low cost system based on the AM335x series processor. The goal is to explain how system design choices affect power consumption and how power consumption can vary significantly depending on how the developer’s application runs in that system under specific conditions.
  • AM335x Reliability Considerations in PLC Applications (Rev. A)
    PDF, 112 Kb, Revisión: A, Archivo publicado: abr 27, 2017
    Programmable Logic Controllers (PLC) are used as the main control in an automation system with high-reliability expectations and long life in harsh environments. Processors used in these applications require an assessment of performance verses expected power on hours to achieve the optimal performance for the application.
  • AM335x and AM43xx Sitara Processors USB Layout Guidelines (Rev. A)
    PDF, 76 Kb, Revisión: A, Archivo publicado: agosto 21, 2014
    This application report discusses best-practice layout guidelines when implementing a universal serial bus (USB).
  • Processor SDK RTOS Customization: Modifying Board library to change UART instanc
    PDF, 783 Kb, Archivo publicado: marzo 4, 2016
  • AM335x Thermal Considerations
    PDF, 16 Kb, Archivo publicado: abr 15, 2013
    This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of the processor's thermal performance, suggests improvements for an end system to aid in overcoming some of the existing challenges of producing a good thermal design, and provides real power/thermal data measured with AM335x EVMs for user evaluation.
  • nFBGA Packaging (Rev. B)
    PDF, 3.1 Mb, Revisión: B, Archivo publicado: nov 13, 2015
    This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
  • 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
    PDF, 40.5 Mb, Revisión: A, Archivo publicado: agosto 9, 2015
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Kb, Revisión: A, Archivo publicado: agosto 17, 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, Revisión: B, Archivo publicado: agosto 13, 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, Revisión: G, Archivo publicado: jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Linea modelo

Clasificación del fabricante

  • Semiconductors> Processors> Sitara Processors> ARM Cortex-A8> AM335x