Datasheet Texas Instruments ISO7320-Q1 — Ficha de datos

FabricanteTexas Instruments
SerieISO7320-Q1

Aislador digital automotriz, de baja potencia, doble canal 2/0

Hojas de datos

ISO732x-Q1 Robust EMC, Low Power, Dual-Channel Digital Isolators datasheet
PDF, 1.3 Mb, Archivo publicado: nov 16, 2015
Extracto del documento

Precios

Estado

ISO7320CQDQ1ISO7320CQDRQ1ISO7320FCQDQ1ISO7320FCQDRQ1
Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNoNo

Embalaje

ISO7320CQDQ1ISO7320CQDRQ1ISO7320FCQDQ1ISO7320FCQDRQ1
N1234
Pin8888
Package TypeDDDD
Industry STD TermSOICSOICSOICSOIC
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY752500752500
CarrierTUBELARGE T&RTUBELARGE T&R
Device Marking7320Q7320Q7320FQ7320FQ
Width (mm)3.913.913.913.91
Length (mm)4.94.94.94.9
Thickness (mm)1.581.581.581.58
Pitch (mm)1.271.271.271.27
Max Height (mm)1.751.751.751.75
Mechanical DataDescargarDescargarDescargarDescargar

Paramétricos

Parameters / ModelsISO7320CQDQ1ISO7320CQDRQ1ISO7320FCQDQ1ISO7320FCQDRQ1
Data Rate(Max), Mbps25252525
Default OutputHighHighLowLow
Forward/Reverse Channels2/02/02/02/0
Integrated Isolated PowerNoNoNoNo
Isolation Rating, Vrms3000300030003000
Number of Channels2222
Operating Temperature Range, C-40 to 125-40 to 125-40 to 125-40 to 125
Package GroupSOICSOICSOICSOIC
Package Size: mm2:W x L, PKG8SOIC: 29 mm2: 6 x 4.9(SOIC)8SOIC: 29 mm2: 6 x 4.9(SOIC)8SOIC: 29 mm2: 6 x 4.9(SOIC)8SOIC: 29 mm2: 6 x 4.9(SOIC)
Propagation Delay, ns31313131
Propagation Delay(Typ), ns31313131
RatingAutomotiveAutomotiveAutomotiveAutomotive
Surge Voltage Rating, Vpk6000600060006000
VCC(Max), V5555
VCC(Min), V3.33.33.33.3

Plan ecológico

ISO7320CQDQ1ISO7320CQDRQ1ISO7320FCQDQ1ISO7320FCQDRQ1
RoHSObedienteObedienteObedienteObediente

Notas de aplicación

  • Shelf-Life Evaluation of Lead-Free Component Finishes
    PDF, 1.3 Mb, Archivo publicado: mayo 24, 2004
    The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a

Linea modelo

Clasificación del fabricante

  • Semiconductors> Isolation> Digital Isolators