Datasheet Texas Instruments ISO7321-Q1 — Ficha de datos

Fabricante	Texas Instruments
Serie	ISO7321-Q1

Aislador digital automotriz, de baja potencia, doble canal 1/1

Hojas de datos

PDF, 1.3 Mb, Archivo publicado: nov 16, 2015

Extracto del documento

	ISO7321CQDQ1	ISO7321CQDRQ1	ISO7321FCQDQ1	ISO7321FCQDRQ1
Estado del ciclo de vida	Activo (Recomendado para nuevos diseños)	Activo (Recomendado para nuevos diseños)	Activo (Recomendado para nuevos diseños)	Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricante	No	Sí	Sí	No

	ISO7321CQDQ1	ISO7321CQDRQ1	ISO7321FCQDQ1	ISO7321FCQDRQ1
N	1	2	3	4
Pin	8	8	8	8
Package Type	D	D	D	D
Industry STD Term	SOIC	SOIC	SOIC	SOIC
JEDEC Code	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G
Package QTY	75	2500	75	2500
Carrier	TUBE	LARGE T&R	TUBE	LARGE T&R
Device Marking	7321Q	7321Q	7321FQ	7321FQ
Width (mm)	3.91	3.91	3.91	3.91
Length (mm)	4.9	4.9	4.9	4.9
Thickness (mm)	1.58	1.58	1.58	1.58
Pitch (mm)	1.27	1.27	1.27	1.27
Max Height (mm)	1.75	1.75	1.75	1.75
Mechanical Data	Descargar	Descargar	Descargar	Descargar

Parameters / Models	ISO7321CQDQ1	ISO7321CQDRQ1	ISO7321FCQDQ1	ISO7321FCQDRQ1
Data Rate(Max), Mbps	25	25	25	25
Default Output	High	High	Low	Low
Forward/Reverse Channels	1/1	1/1	1/1	1/1
Integrated Isolated Power	No	No	No	No
Isolation Rating, Vrms	3000	3000	3000	3000
Number of Channels	2	2	2	2
Operating Temperature Range, C	-40 to 125	-40 to 125	-40 to 125	-40 to 125
Package Group	SOIC	SOIC	SOIC	SOIC
Package Size: mm2:W x L, PKG	8SOIC: 29 mm2: 6 x 4.9(SOIC)	8SOIC: 29 mm2: 6 x 4.9(SOIC)	8SOIC: 29 mm2: 6 x 4.9(SOIC)	8SOIC: 29 mm2: 6 x 4.9(SOIC)
Propagation Delay, ns	31	31	31	31
Propagation Delay(Typ), ns	31	31	31	31
Rating	Automotive	Automotive	Automotive	Automotive
Surge Voltage Rating, Vpk	6000	6000	6000	6000
VCC(Max), V	5	5	5	5
VCC(Min), V	3.3	3.3	3.3	3.3

	ISO7321CQDQ1	ISO7321CQDRQ1	ISO7321FCQDQ1	ISO7321FCQDRQ1
RoHS	Obediente	Obediente	Obediente	Obediente

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Shelf-Life Evaluation of Lead-Free Component Finishes
PDF, 1.3 Mb, Archivo publicado: mayo 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a

Serie: ISO7321-Q1 (4)