Datasheet Texas Instruments LMZ22008 — Ficha de datos

Fabricante	Texas Instruments
Serie	LMZ22008

Hojas de datos

Precios

Estado

Embalaje

Paramétricos

Parameters / Models	LMZ22008TZ/NOPB	LMZ22008TZE/NOPB
Iout(Max), A	8	8
Iq(Typ), mA	3	3
Operating Temperature Range, C	-40 to 85	-40 to 85
Package Size: mm2:W x L, PKG	See datasheet (PFM)	See datasheet (PFM)
Package Type	Leaded	Leaded
Regulated Outputs	1	1
Soft Start	Adjustable	Adjustable
Special Features	Current Sharing,EMI Tested,Enable,Frequency Synchronization,Tracking	Current Sharing,EMI Tested,Enable,Frequency Synchronization,Tracking
Switching Frequency(Max), kHz	600	600
Switching Frequency(Min), kHz	350	350
Switching Frequency(Typ), kHz	359	359
Vin(Max), V	20	20
Vin(Min), V	6	6
Vout(Max), V	6	6
Vout(Min), V	0.8	0.8

Plan ecológico

Notas de aplicación

• Descargar
  Understanding and Applying Current-Mode Control Theory
  PDF, 409 Kb, Archivo publicado: agosto 19, 2007
• Descargar
  AN-643 EMI/RFI Board Design (Rev. B)
  PDF, 742 Kb, Revisión: B, Archivo publicado: mayo 3, 2004
  Application Note 643 EMI/RFI Board Design
• Descargar
  Input and Output Capacitor Selection
  PDF, 219 Kb, Archivo publicado: sept 19, 2005
• Descargar
  AN-2145 Power Considerations for SDI Products (Rev. B)
  PDF, 63 Kb, Revisión: B, Archivo publicado: abr 26, 2013
  This application report discusses the issues and trade-offs that VCC ripple has on the performance of SDI components.
• Descargar
  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, Revisión: A, Archivo publicado: abr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
• Descargar
  Design Summary LMZ1xxx and LMZ2xxx Power Module Family (Rev. B)
  PDF, 996 Kb, Revisión: B, Archivo publicado: enero 20, 2016
• Descargar
  AN-2026 Effect of PCB Design on Thermal Performance of SIMPLE SWITCHER Modules (Rev. A)
  PDF, 455 Kb, Revisión: A, Archivo publicado: abr 23, 2013
  This application report focuses on the low current modules that come in a 7 lead, 10.16 x 4.57 x 9.81 mmpackage.
• Descargar
  AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
  PDF, 2.7 Mb, Revisión: A, Archivo publicado: abr 23, 2013
  This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
• Descargar
  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, Revisión: C, Archivo publicado: abr 19, 2016
• Descargar
  AN-2020 Thermal Design By Insight, Not Hindsight (Rev. C)
  PDF, 568 Kb, Revisión: C, Archivo publicado: abr 23, 2013
  This application report provides an in-depth discussion of thermal design.
• Descargar
  AN-2078 PCB Layout for Texas Instruments SIMPLE SWITCHER Power Modules (Rev. A)
  PDF, 1.1 Mb, Revisión: A, Archivo publicado: abr 23, 2013
  This application report discusses the best PCB layout methods, practices and techniques to maximize themodule’s performance.
• Descargar
  AN-2052 Texas Instruments SIMPLE SWITCHER Power Modules and EMI (Rev. C)
  PDF, 99 Kb, Revisión: C, Archivo publicado: abr 23, 2013
  While the principles discussed in this application report apply more broadly to power design, we will focuson DC to DC convertor design given its broad application. It affects virtually every hardware engineer whoat some point has to design a power convertor. In this application report we will consider two commontrade-offs related to low EMI design; thermal performance and EMI and also solut
• Descargar
  AN-2146 Power Design for SDI and Other Noise-Sensitive Devices (Rev. A)
  PDF, 1.4 Mb, Revisión: A, Archivo publicado: abr 26, 2013
  This application report discusses various solutions for meeting the power requirements of serial digital interface (SDI) video components.
• Descargar
  AN-2027 Inverting Application for the LMZ14203 SIMPLE SWITCHER Power Module (Rev. A)
  PDF, 244 Kb, Revisión: A, Archivo publicado: mayo 6, 2013
  This application report illustrates how to apply the LMZ14203 integrated buck module into the buck-boost configuration such that a positive input voltage can be used to create a regulated negative output voltage.
• Descargar
  AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
  PDF, 82 Kb, Revisión: C, Archivo publicado: abr 23, 2013
  When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
• Descargar
  AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
  PDF, 374 Kb, Revisión: C, Archivo publicado: abr 23, 2013
  This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
• Descargar
  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, Revisión: C, Archivo publicado: abr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
• Descargar
  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, Revisión: B, Archivo publicado: abr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Linea modelo

Clasificación del fabricante

• Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module