Datasheet Texas Instruments LP5562 — Ficha de datos

FabricanteTexas Instruments
SerieLP5562
Datasheet Texas Instruments LP5562

Controlador de LED blanco / RGB de 4 canales con memoria interna de programa y control de canal independiente

Hojas de datos

LP5562 Four-Channel RGB- or White-LED Driver With Internal Program Memory and Independent Channel Control datasheet
PDF, 1.3 Mb, Revisión: B, Archivo publicado: dic 6, 2016
Extracto del documento

Precios

Estado

LP5562TME/NOPBLP5562TMX/NOPB
Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNo

Embalaje

LP5562TME/NOPBLP5562TMX/NOPB
N12
Pin1212
Package TypeYQEYQE
Industry STD TermDSBGADSBGA
JEDEC CodeR-XBGA-NR-XBGA-N
Package QTY2503000
CarrierSMALL T&RLARGE T&R
Device MarkingD5D5
Pitch (mm).4.4
Max Height (mm).675.675
Mechanical DataDescargarDescargar

Paramétricos

Parameters / ModelsLP5562TME/NOPB
LP5562TME/NOPB
LP5562TMX/NOPB
LP5562TMX/NOPB
Number of Channels44
Iout(Max), A0.110.11
Iq(Typ), mA11
LED44
LED ConfigurationParallelParallel
LED Current Per Channel, mA25.525.5
Operating Temperature Range, C-40 to 85-40 to 85
Package GroupDSBGADSBGA
Package Size: mm2:W x L, PKGSee datasheet (DSBGA)See datasheet (DSBGA)
Peak Efficiency, %100100
Program MemoryYesYes
Programmable Ramp ControlYesYes
RatingCatalogCatalog
Shutdown Current(Typ), uA0.20.2
Special FeaturesAnalog/PWM Mixed Dimming,Constant Current,Current Control,I2C Control,Programmable Lighting EnginesAnalog/PWM Mixed Dimming,Constant Current,Current Control,I2C Control,Programmable Lighting Engines
TopologyLinearLinear
Vin(Max), V5.55.5
Vin(Min), V2.72.7
Vout(Max), V5.55.5
Vout(Min), V2.72.7

Plan ecológico

LP5562TME/NOPBLP5562TMX/NOPB
RoHSObedienteObediente

Notas de aplicación

  • Routing the Middle Pins of the LP5562
    PDF, 202 Kb, Archivo publicado: abr 1, 2016
    The LP5562 is available in 12-bump DSBGA package with 0.4-mm pitch. This can be a limitation in costsensitive applications as routing out the middle bumps separately requires HDI PCB technology whichadds cost to the PCB manufacturing process.

Linea modelo

Clasificación del fabricante

  • Semiconductors> Power Management> LED Driver> Indicator/RGBW