Datasheet Texas Instruments OMAP3503 — Ficha de datos

FabricanteTexas Instruments
SerieOMAP3503
Datasheet Texas Instruments OMAP3503

Procesador de aplicaciones

Hojas de datos

OMAP3515 and OMAP3503 Applications Processors datasheet
PDF, 2.7 Mb, Revisión: H, Archivo publicado: oct 10, 2013
Extracto del documento

Precios

Estado

OMAP3503DCBBOMAP3503DCBBAOMAP3503DCBCOMAP3503DCBCAOMAP3503DCUSOMAP3503DCUS72OMAP3503DCUSAOMAP3503ECBBOMAP3503ECBBAOMAP3503ECBBALPDOMAP3503ECBCOMAP3503ECBCAOMAP3503ECUSOMAP3503ECUS72OMAP3503ECUSA
Estado del ciclo de vidaObsoleto (El fabricante ha interrumpido la producción del dispositivo)Obsoleto (El fabricante ha interrumpido la producción del dispositivo)Obsoleto (El fabricante ha interrumpido la producción del dispositivo)Obsoleto (El fabricante ha interrumpido la producción del dispositivo)Obsoleto (El fabricante ha interrumpido la producción del dispositivo)Obsoleto (El fabricante ha interrumpido la producción del dispositivo)Obsoleto (El fabricante ha interrumpido la producción del dispositivo)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNoNoNoNoNoNoNoNo

Embalaje

OMAP3503DCBBOMAP3503DCBBAOMAP3503DCBCOMAP3503DCBCAOMAP3503DCUSOMAP3503DCUS72OMAP3503DCUSAOMAP3503ECBBOMAP3503ECBBAOMAP3503ECBBALPDOMAP3503ECBCOMAP3503ECBCAOMAP3503ECUSOMAP3503ECUS72OMAP3503ECUSA
N123456789101112131415
Pin515515515515423423423515515515515515423423423
Package TypeCBBCBBCBCCBCCUSCUSCUSCBBCBBCBBCBCCBCCUSCUSCUS
Industry STD TermPOP-FCBGAPOP-FCBGAPOP-FCBGAPOP-FCBGAFC/CSPFC/CSPFC/CSPPOP-FCBGAPOP-FCBGAPOP-FCBGAPOP-FCBGAPOP-FCBGAFC/CSPFC/CSPFC/CSP
JEDEC CodeS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-N
Device Marking3503DCBB3503DCBB3503DCBCA3503DCUS3503DCUS72A3503ECBBAA3503ECBCA3503ECUS3503ECUS72A
Width (mm)121214141616161212121414161616
Length (mm)121214141616161212121414161616
Thickness (mm).61.61.63.63.96.96.96.61.61.61.63.63.96.96.96
Pitch (mm).4.4.5.5.65.65.65.4.4.4.5.5.65.65.65
Max Height (mm).9.9.95.951.41.41.4.9.9.9.95.951.41.41.4
Mechanical DataDescargarDescargarDescargarDescargarDescargarDescargarDescargarDescargarDescargarDescargarDescargarDescargarDescargarDescargarDescargar
Package QTY168168168119119909090
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)

Paramétricos

Parameters / ModelsOMAP3503DCBB
OMAP3503DCBB
OMAP3503DCBBA
OMAP3503DCBBA
OMAP3503DCBC
OMAP3503DCBC
OMAP3503DCBCA
OMAP3503DCBCA
OMAP3503DCUS
OMAP3503DCUS
OMAP3503DCUS72
OMAP3503DCUS72
OMAP3503DCUSA
OMAP3503DCUSA
OMAP3503ECBB
OMAP3503ECBB
OMAP3503ECBBA
OMAP3503ECBBA
OMAP3503ECBBALPD
OMAP3503ECBBALPD
OMAP3503ECBC
OMAP3503ECBC
OMAP3503ECBCA
OMAP3503ECBCA
OMAP3503ECUS
OMAP3503ECUS
OMAP3503ECUS72
OMAP3503ECUS72
OMAP3503ECUSA
OMAP3503ECUSA
ARM CPU1 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A8
ARM MHz, Max.720720720720720720720720
ARM MHz (Max.)720720720720720720720
ApplicationsCommunications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal Electronics
Approx. Price (US$)23.00 | 1ku23.00 | 1ku23.00 | 1ku23.00 | 1ku23.00 | 1ku23.00 | 1ku23.00 | 1ku
DRAMLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDR
Display OptionsLCD
rotation/resizing
multidisplay
LCD
rotation/resizing
multidisplay
LCD
rotation/resizing
multidisplay
LCD
rotation/resizing
multidisplay
LCD
rotation/resizing
multidisplay
LCD
rotation/resizing
multidisplay
LCD
rotation/resizing
multidisplay
LCD,rotation/resizing,multidisplayLCD,rotation/resizing,multidisplayLCD,rotation/resizing,multidisplayLCD,rotation/resizing,multidisplayLCD,rotation/resizing,multidisplayLCD,rotation/resizing,multidisplayLCD,rotation/resizing,multidisplayLCD,rotation/resizing,multidisplay
I2C333333333333333
On-Chip L2 Cache256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)
Operating SystemsNeutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks
Neutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks
Neutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks
Neutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks
Neutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks
Neutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks
Neutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks
Integrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CEIntegrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CEIntegrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CEIntegrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CEIntegrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CEIntegrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CEIntegrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CEIntegrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CE
Operating Temperature Range, C-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90
Operating Temperature Range(C)-40 to 105
0 to 90
-40 to 105
0 to 90
-40 to 105
0 to 90
-40 to 105
0 to 90
-40 to 105
0 to 90
-40 to 105
0 to 90
-40 to 105
0 to 90
Other On-Chip Memory64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
SPI444444444444444
UART, SCI33333333
UART(SCI)3333333
USB222222222222222
Video Port, Configurable1 Input,1 Output1 Input,1 Output1 Input,1 Output1 Input,1 Output1 Input,1 Output1 Input,1 Output1 Input,1 Output1 Input,1 Output
Video Port (Configurable)1 Input
1 Output
1 Input
1 Output
1 Input
1 Output
1 Input
1 Output
1 Input
1 Output
1 Input
1 Output
1 Input
1 Output

Plan ecológico

OMAP3503DCBBOMAP3503DCBBAOMAP3503DCBCOMAP3503DCBCAOMAP3503DCUSOMAP3503DCUS72OMAP3503DCUSAOMAP3503ECBBOMAP3503ECBBAOMAP3503ECBBALPDOMAP3503ECBCOMAP3503ECBCAOMAP3503ECUSOMAP3503ECUS72OMAP3503ECUSA
RoHSDesobedienteDesobedienteDesobedienteDesobedienteDesobedienteDesobedienteDesobedienteObedienteObedienteObedienteObedienteObedienteObedienteObedienteObediente
Pb gratisNoNoNoNoNoNoNo

Notas de aplicación

  • Demystify DSI I/F
    PDF, 1.8 Mb, Archivo publicado: nov 30, 2012
  • Powering OMAP3 With TPS6235x: Design-In Guide
    PDF, 296 Kb, Archivo publicado: dic 3, 2008
    The OMAP35xx Applications Processors have a diverse set of power management features which potentially enable lower cost power solutions based on your application. This design-in guide describes a power solution based on the TPS6235x device. This guide can be used to evaluate this solution for your design or help you make decisions when designing in this solution.
  • OMAP3530/25/15/03 CBB CBC & CUS Reflow Profiles
    PDF, 27 Kb, Archivo publicado: nov 13, 2009
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

    http://wiki.davincidsp.com/index.php/OMAP3_CBB_CBC_CUS_Reflow_Profiles

    Reflow profiles are dependent on numerous factors including package type number of components bo

  • OMAP35x Linux PSP Data Sheet
    PDF, 1.6 Mb, Archivo publicado: oct 16, 2009
  • OMAP35x 0.65mm Pitch Layout Methods (Rev. B)
    PDF, 372 Kb, Revisión: B, Archivo publicado: jun 26, 2008
    It is easy to see from the unique look that the OMAP35x parts have a very unusual footprint. The OMAP35x ball grid array is designed with new technology called the Via Channel array which makes significant printed circuit board (PCB) cost savings possible. If the PCB is routed correctly this cost savings can be substantial. This application report explains how this is possible and shows several
  • Powering OMAP3 With TPS65023: Design-In Guide (Rev. B)
    PDF, 181 Kb, Revisión: B, Archivo publicado: marzo 2, 2009
  • OMAP35x to AM35x Hardware Migration Guide
    PDF, 19 Kb, Archivo publicado: mayo 24, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

    http://processors.wiki.ti.com/index.php/OMAP35x_to_AM35x_Hardware_Migration_Guide.

    This article describes hardware device considerations to migrate a design

  • OMAP35x to AM37x Hardware Migration Guide
    PDF, 37 Kb, Archivo publicado: jun 3, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

    http://processors.wiki.ti.com/index.php/OMAP35x_To_AM37x_Hardware_Migration_Guide.

    The OMAP35x to AM37x Hardware Migration Guide describes device consideratio

  • PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages Part II (Rev. A)
    PDF, 2.4 Mb, Revisión: A, Archivo publicado: nov 1, 2013
    Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.

    PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char

  • PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages Part I (Rev. B)
    PDF, 6.7 Mb, Revisión: B, Archivo publicado: jun 13, 2009
    Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de
  • PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part I
    PDF, 2.0 Mb, Archivo publicado: jun 23, 2010
    Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.

    Fine-pitch PCB design is a team effort and may require more than

  • PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part II
    PDF, 1.2 Mb, Archivo publicado: jun 23, 2010
    Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process

Linea modelo

Clasificación del fabricante

  • Semiconductors> Processors> Sitara Processors> ARM Cortex-A8> AM3x