Datasheet Texas Instruments OMAPL138B-EP — Ficha de datos
| Fabricante | Texas Instruments |
| Serie | OMAPL138B-EP |
Producto mejorado Procesador de aplicaciones de baja potencia
Hojas de datos
OMAPL138B-EP C6000 DSP+ARMВ® Processor datasheet
PDF, 1.8 Mb, Revisión: C, Archivo publicado: abr 12, 2013
Extracto del documento
Estado
| OMAPL138BGWTMEP | V62/12605-01XE | |
|---|---|---|
| Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) |
| Disponibilidad de muestra del fabricante | Sí | No |
Embalaje
| OMAPL138BGWTMEP | V62/12605-01XE | |
|---|---|---|
| N | 1 | 2 |
| Pin | 361 | 361 |
| Package Type | GWT | GWT |
| Industry STD Term | NFBGA | NFBGA |
| JEDEC Code | S-PBGA-N | S-PBGA-N |
| Package QTY | 90 | 90 |
| Carrier | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) |
| Device Marking | GWTMEP | GWTMEP |
| Width (mm) | 16 | 16 |
| Length (mm) | 16 | 16 |
| Thickness (mm) | .9 | .9 |
| Pitch (mm) | .8 | .8 |
| Max Height (mm) | 1.4 | 1.4 |
| Mechanical Data | Descargar | Descargar |
Paramétricos
| Parameters / Models | OMAPL138BGWTMEP | V62/12605-01XE |
|---|---|---|
| ARM CPU | 1 ARM9 | 1 ARM9 |
| ARM MHz, Max. | 345 | 345 |
| Applications | Communications and Telecom,Energy,Industrial,Medical | Communications and Telecom,Energy,Industrial,Medical |
| DRAM | LPDDR,DDR2 | LPDDR,DDR2 |
| DSP | 1 C674x | 1 C674x |
| DSP MHz, Max. | 345 | 345 |
| Display Options | 1 | 1 |
| EMAC | 10/100 | 10/100 |
| I2C | 2 | 2 |
| On-Chip L2 Cache | 256 KB (DSP) | 256 KB (DSP) |
| Operating Systems | Linux,SYS/BIOS | Linux,SYS/BIOS |
| Operating Temperature Range, C | -55 to 125 | -55 to 125 |
| Other On-Chip Memory | 128 KB | 128 KB |
| Rating | HiRel Enhanced Product | HiRel Enhanced Product |
| SPI | 2 | 2 |
| UART, SCI | 3 | 3 |
| USB | 2 | 2 |
| Video Port, Configurable | 1 | 1 |
Plan ecológico
| OMAPL138BGWTMEP | V62/12605-01XE | |
|---|---|---|
| RoHS | See ti.com | See ti.com |
Notas de aplicación
- Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, Revisión: B, Archivo publicado: agosto 13, 2015
- nFBGA Packaging (Rev. B)PDF, 3.1 Mb, Revisión: B, Archivo publicado: nov 13, 2015
This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts. - 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)PDF, 40.5 Mb, Revisión: A, Archivo publicado: agosto 9, 2015
Linea modelo
Serie: OMAPL138B-EP (2)
Clasificación del fabricante
- Semiconductors> Space & High Reliability> Processor> Digital Signal Processor> C6000 DSP + ARM Processor