Datasheet Texas Instruments SN54AS808B — Ficha de datos

FabricanteTexas Instruments
SerieSN54AS808B
Datasheet Texas Instruments SN54AS808B

Hex de 2 entradas y controladores

Hojas de datos

Hex 2-Input And Drivers datasheet
PDF, 608 Kb, Revisión: C, Archivo publicado: enero 1, 1995
Extracto del documento

Precios

Estado

5962-88522012A5962-8852201RA5962-8852201SASN54AS808BJSNJ54AS808BFKSNJ54AS808BJ
Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Obsoleto (El fabricante ha interrumpido la producción del dispositivo)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNoNoNoNoNoNo

Embalaje

5962-88522012A5962-8852201RA5962-8852201SASN54AS808BJSNJ54AS808BFKSNJ54AS808BJ
N123456
Pin202020202020
Package TypeFKJJJFKJ
Industry STD TermLCCCCDIPCDIPCDIPLCCCCDIP
JEDEC CodeS-CQCC-NR-GDIP-TR-GDIP-TR-GDIP-TS-CQCC-NR-GDIP-T
Package QTY11111
CarrierTUBETUBETUBETUBETUBE
Width (mm)8.896.926.926.928.896.92
Length (mm)8.8924.224.224.28.8924.2
Thickness (mm)1.834.574.574.571.834.57
Pitch (mm)1.272.542.542.541.272.54
Max Height (mm)2.035.085.085.082.035.08
Mechanical DataDescargarDescargarDescargarDescargarDescargarDescargar
Device MarkingSN54AS808BJSNJ54AS5962-8852201RA

Paramétricos

Parameters / Models5962-88522012A
5962-88522012A
5962-8852201RA
5962-8852201RA
5962-8852201SA
5962-8852201SA
SN54AS808BJ
SN54AS808BJ
SNJ54AS808BFK
SNJ54AS808BFK
SNJ54AS808BJ
SNJ54AS808BJ
Bits66666
F @ Nom Voltage(Max), Mhz125125125125125
ICC @ Nom Voltage(Max), mA0.0130.0130.0130.0130.013
Input TypeTTLTTLTTLTTLTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125
Operating Temperature Range(C)-55 to 125
Output Drive (IOL/IOH)(Max), mA-2/20-2/20-2/20-2/20-2/20
Output TypeTTLTTLTTLTTLTTLTTL
Package GroupLCCCCDIPCDIPCDIPLCCCCDIP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)
Package Size: mm2:W x L (PKG)See datasheet (CDIP)
RatingMilitaryMilitaryMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNoNoNo
Technology FamilyASASASASASAS
VCC(Max), V5.55.55.55.55.5
VCC(Max)(V)5.5
VCC(Min), V4.54.54.54.54.5
VCC(Min)(V)4.5
tpd @ Nom Voltage(Max), ns6.56.56.56.56.5
tpd @ Nom Voltage(Max)(ns)6.5

Plan ecológico

5962-88522012A5962-8852201RA5962-8852201SASN54AS808BJSNJ54AS808BFKSNJ54AS808BJ
RoHSSee ti.comSee ti.comDesobedienteSee ti.comSee ti.comSee ti.com
Pb gratisNo

Notas de aplicación

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    PDF, 1.9 Mb, Archivo publicado: agosto 1, 1995
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    PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Archivo publicado: jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, Archivo publicado: abr 30, 2015
  • Shelf-Life Evaluation of Lead-Free Component Finishes
    PDF, 1.3 Mb, Archivo publicado: mayo 24, 2004
    The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a

Linea modelo

Clasificación del fabricante

  • Semiconductors> Space & High Reliability> Logic Products> Gate Products