Datasheet Texas Instruments TLE2426-EP — Ficha de datos
| Fabricante | Texas Instruments |
| Serie | TLE2426-EP |
Suelo virtual de precisión de divisor de riel de producto mejorado
Hojas de datos
The Rail Splitter Precision Virtual Ground datasheet
PDF, 758 Kb, Archivo publicado: marzo 20, 2006
Extracto del documento
Estado
| TLE2426MDREP | V62/06601-01XE | |
|---|---|---|
| Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) |
| Disponibilidad de muestra del fabricante | No | No |
Embalaje
| TLE2426MDREP | V62/06601-01XE | |
|---|---|---|
| N | 1 | 2 |
| Pin | 8 | 8 |
| Package Type | D | D |
| Industry STD Term | SOIC | SOIC |
| JEDEC Code | R-PDSO-G | R-PDSO-G |
| Package QTY | 2500 | 2500 |
| Carrier | LARGE T&R | LARGE T&R |
| Device Marking | 2426EP | 2426EP |
| Width (mm) | 3.91 | 3.91 |
| Length (mm) | 4.9 | 4.9 |
| Thickness (mm) | 1.58 | 1.58 |
| Pitch (mm) | 1.27 | 1.27 |
| Max Height (mm) | 1.75 | 1.75 |
| Mechanical Data | Descargar | Descargar |
Paramétricos
| Parameters / Models | TLE2426MDREP | V62/06601-01XE |
|---|---|---|
| Operating Temperature Range, C | -55 to 125 | -55 to 125 |
| Package Group | SOIC | SOIC |
| Package Size: mm2:W x L, PKG | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) |
| Pin/Package | 8SOIC | 8SOIC |
| Rating | HiRel Enhanced Product | HiRel Enhanced Product |
Plan ecológico
| TLE2426MDREP | V62/06601-01XE | |
|---|---|---|
| RoHS | Obediente | Obediente |
Linea modelo
Serie: TLE2426-EP (2)
Clasificación del fabricante
- Semiconductors> Space & High Reliability> Special Function