Package Intersil V256.13.5x13.5 — Ficha de datos
256 paquete de matriz de rejilla de bola de plástico de paso fino de perfil bajo
Package Outline Drawing (POD)
Paramétricos
| Family | LFBGA | 
| Pin Count | 256 | 
| Height max | 1.70 mm | 
| Weight | 0.722 g | 
| Pitch | 0.80 mm | 
| Peak Temperature | 235 °C | 
| Lead Free Peak Temperature | 260 °C | 
| Features | Low Profile, Fine | 
| Package Index | V256.13.5X13.5 | 
Linea modelo
Serie: BGA (14)
Clasificación del fabricante
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