Plastic Packages for Integrated Circuits
Low Plastic Quad Flatpack Exposed Pad Package (LQFP-EP)
4X Q128.14x14A 0.2 YT-U Z 128 Lead Low Plastic Quad Flatpack Exposed Pad Package
(0.4mm pitch) D PIN 1
128 97 Z 1 MILLIMETERS 96 SYMBOL U T
E E1 32 65
33
4X NOM 0.2 HT-U Z A -1.60 0.05 -0.15 A2 1.35 1.40 1.45 b 0.13 0.18 0.23 b1 0.13 0.16 0.19 c 0.09 -0.20 c1 0.09 -0.16 14 BSC 3 E 16 BSC 4 14 BSC
0.45 Y
124X e
SEATING PLANE 0.080 Y 0.07 YT-UZ
b
c
PLATING c1
b 3 0.60 L1 0.75 1.00 REF R1 128X b 4 D1 L H NOTES 16 BSC E1 DETAIL F MAX A1 D 64
D1 MIN 0.08 -R2 0.08 -0.20 S 0.20 -Оё 0В° 3.5В° 7.0В° Оё1 0В° -Оё2 11В° 12В° 13В° Оё3 11В° 12В° 13В° e 0.40 BSC M 6.855 6.955 7.055 N 6.855 6.955 7.055
Rev. 1 7/11 NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only. N 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Dimensions D1 and E1 are excluding mold protrusion. Allowable
protrusion is 0.25mm per side. Dimensions D1 and E1 are
inclusive of mold mismatch and determined by datum plane H.
4. Dimension b does not include dambar protrusion. Allowable …
