Plastic Packages for Integrated Circuits
Low Plastic Quad Flatpack Package with Top Exposed Pad (LQFP-TEP)
Q128.14x20A 4
D
NOTE: EXPOSED PAD 128 Lead Low Quad Flatpack with Top Exposed Pad D/2
D MILLIMETERS 3 BHB
3 SYMBOL A
B 3 D2 E 4 e
E2 N/4 TIPS
0.20 C A-B D 4X SEE DETAIL "A" TOP VIEW
5 7
D1/2 XX U NT RY E1/2
5 -1.60 0.05 -0.15 A2 1.35 1.40 1.45 7
E1 NOTES
13 22 BSC 4 D1 20 BSC 7, 8 D2 12.50 BSC 14 E 16 BSC 4 E1 14 BSC 7, 8 L CO MAX A E2 D1 NOM A1
D E/2 PIN 1 ID MIN 6.5 BSC
0.45 0.60 N 128 e 0.50 BSC 14
0.75 b 0.17 0.22 0.27 b1 0.17 0.20 0.23 ccc 0.08 ddd 0.08 9 Rev. 1 7/11
4X NOTES: BOTTOM VIEW 0.20 H A-B D 1. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 8 PLACES
11/13В° 2. Datum plane H located at mold parting line and coincident with
lead, where lead exits plastic body at bottom of parting line. A
H 0.05 2 / / 0.10 C ccc C 4. To be determined at seating plane C. SEE DETAIL "B" 5. Dimensions D1 and E1 do not include mold protrusion. Allowable
mold protrusion is 0.254mm per side on D1 and E1 dimensions. ddd M C A-B S D S 9 WITH LEAD FINISH b 0.09/0.20 6. “N” is the total number of terminals. …
