Package Outline Drawing
Y32.17.2x11.45
32 I/O 17.2mm x 11.45mm x 2.5mm HDA MODULE
Rev 1, 11/12
PIN A1 INDICATOR
C = 0.35 7.00
DATUM A
17.20 A TERMINAL #A1
INDEX AREA B SEE DETAIL B 1 0.10 0.10 C 2X 16.50В±0.15
0.10
C AB 0.10 C 2X TOP VIEW 0.90В±0.10 DATUM B BOTTOM VIEW
1.00 0.18В±0.10
2.50 MAX
0.10 C
0.08 C 1.00 SEATING PLANE 0.025 MAX SIDE VIEW C
3 0.10 C A B
0.05 C
27x(0.60В±0.05) 0.55В±0.10 NOTES:
1. All dimensions are in millimeters. 2. 1.0mmx1.0mm represents the basic land grid pitch. 3. “27” is the total number of I/O (excluding large pads).
All 27 I/O’s are centered in a fixed row and column
matrix at 1.0mm pitch BSC. 4. Dimensioning and tolerancing per ASME Y14.5M-1994. 5. Tolerance for exposed DAP edge location dimension on
page 2 is В±0.1mm. 2.00 0.55В±0.10
3 DETAIL B 27x(0.60В±0.05) 1.00 TERMINAL TIP 0.95 …
