Plastic Packages for Integrated Circuits
HMSOP (Heat-Sink MSOP) Package Family
E
B 0.25 M C A B E1 MDP0050
HMSOP (HEAT-SINK MSOP) PACKAGE FAMILY
MILLIMETERS 1 N SYMBOL
D
(N/2)+1 (N/2) PIN #1
I.D. A HMSOP8 HMSOP10 TOLERANCE NOTES A 1.00 1.00 Max. -A1 0.075 0.075 +0.025/-0.050 -A2 0.86 0.86 В±0.09 -b 0.30 0.20 +0.07/-0.08 -c 0.15 0.15 В±0.05 -D 3.00 3.00 В±0.10 1, 3 D1 1.85 1.85 Reference -E 4.90 4.90 В±0.15 -E1 3.00 3.00 В±0.10 2, 3 E2 1.73 1.73 Reference -e 0.65 0.50 Basic -L 0.55 0.55 В±0.15 -L1 0.95 0.95 Basic -N 8 10 Reference -TOP VIEW E2 EXPOSED
THERMAL PAD D1 BOTTOM VIEW Rev. 1 2/07
e NOTES: H 1. Plastic or metal protrusions of 0.15mm maximum per side are not
included. C
SEATING
PLANE 2. Plastic interlead protrusions of 0.25mm maximum per side are
not included.
0.08 M C A B b 0.10 C
N LEADS 4. Dimensioning and tolerancing per ASME Y14.5M-1994. SIDE VIEW L1
A
c
END VIEW SEE DETAIL "X" A2
GAUGE
0.25 PLANE
L …
