Plastic Packages for Integrated Circuits Package Outline Drawing
L4.2.00x1.25
4 LD OPTICAL CHIP ON BOARD PACKAGE (COB)
Rev 3, 2/14 PIN 1
INDEX AREA 1.1
4 1 0.360 0.100 1.25 В± 0.05 1.00 В± 0.10 0.700
0.550 2.00 В± 0.05
PIN 3
EXTENDED PAD TOP VIEW PIN 3
EXTENDED PAD 0.450 2 3 0.330 1 BOTTOM VIEW PACKAGE OUTLINE
3x 0.700 1.1 0.100
4x 0.360 2x 0.700
1 0.800 TYPICAL RECOMMENDED LAND PATTERN NOTES: 1 1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Pin 1 is diagonal to extended Pad Pin 3 on bottom surface. …
