Plastic Packages for Integrated Circuits Package Outline Drawing
L7.2.0x3.4
7 LEAD OPTICAL CO-PACKAGE
Rev 0, 5/14 2.0 В±0.050
0.25 INCLUDED L/F THICKNESS 0.2mm
1 В±0.100 0.373
R 0.25 0.45
0.75
0.45
7
1.2 3.4 В±0.050
1.365
83В° DAP
0.808 6 0.3 1
2 5
1.55 7x 0.2 0.45 3 4 0.35
10В° 0.323 0.35 0.884 0.875 1 TOP VIEW SIDE VIEW/ DETAIL 0.558 SIDE VIEW R 0.375 BOTTOM VIEW PACKAGE OUTLINE
0.75 1.2 0.45 0.2
0.35
0.25 0.808 TYPICAL RECOMMENDED LAND PATTERN NOTES: 1 1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Pin #1 identifier is a feature on the bottom surface. 5. No routing allowed underneath the die attach paddle (DAP) area. …
