Plastic Packages for Integrated Circuits
Dual-In-Line Plastic Packages (PDIP)
E28.6 (JEDEC MS-011-AB ISSUE B) N 28 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1 INDEX
AREA 1 2 3 INCHES N/2 SYMBOL
-B-C-A2 SEATING
PLANE e B1 D1 A1 eC B
0.010 (0.25) M C A B S NOTES -0.250 -6.35 4 -0.39 -4 A2 0.125 0.195 3.18 4.95 -B 0.014 0.022 0.356 0.558 -C
L B1 0.030 0.070 0.77 1.77 8 eA C 0.008 0.015 0.204 0.381 -D 1.380 1.565 D1 0.005 -C eB NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C-.
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm). …
