Plastic Packages for Integrated Circuits Package Outline Drawing
M8.15E
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 0, 08/09
4
4.90 В± 0.10 A DETAIL "A" 0.22 В± 0.03 B 6.0 В± 0.20
3.90 В± 0.10
4
PIN NO.1
ID MARK
5
(0.35) x 45° 4° ± 4° 0.43 ± 0.076 1.27 0.25 M C A B SIDE VIEW “B”
TOP VIEW 1.75 MAX 1.45 В± 0.1
0.25
GAUGE PLANE
C
SEATING PLANE
0.10 C 0.175 ± 0.075 SIDE VIEW “A
0.63 В±0.23 DETAIL "A"
(0.60) (1.27) NOTES:
(1.50) (5.40) 1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension does not include interlead flash or protrusions.
Interlead flash or protrusions shall not exceed 0.25mm per side. TYPICAL RECOMMENDED LAND PATTERN 1 5. The pin #1 identifier may be either a mold or mark feature. 6. Reference to JEDEC MS-012. …
