Plastic Packages for Integrated Circuits
Shrink Small Outline Plastic Packages (SSOP)
M28.209 (JEDEC MO-150-AH ISSUE B) N
INDEX
AREA 28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
H 0.25(0.010) M 2 GAUGE
PLANE 3
0.25
0.010 SEATING PLANE
-A-INCHES E
-B-1 B M A D
-C-e О±
C
0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A -0.078 -2.00 -A1 0.002 -0.05 -A2 0.065 0.072 1.65 1.85 -B 0.009 0.014 0.22 0.38 9 C 0.004 0.009 0.09 0.25 -D 0.390 0.413 9.90 10.50 3 E 0.197 0.220 5.00 5.60 4 e A2 A1 B
0.25(0.010) M L B S 0.026 BSC H 0.292 L 0.022 N NOTES: α 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side. …
