Plastic Packages for Integrated Circuits Package Outline Drawing
M16.173A
16 LEAD HEATSINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
Rev 1, 2/15
A
1 3
3.00 В±0.10 5.00 В±0.10 SEE DETAIL "X" 9 16 PIN #1
I.D. MARK 6.40
4.40 В±0.10
2 3.00 В±0.10 3 0.20 C B A 1 8
B 0.65 EXPOSED THERMAL PAD 0.09 TO 0.20
END VIEW TOP VIEW BOTTOM VIEW -0.05 H 1.00 REF
C
1.20 MAX SEATING
PLANE 0.90 +0.15/-0.10
GAUGE
PLANE 0.25 +0.05/-0.06 5
0.10 M C B A 0.10 C 0.25 0В°-8В°
0.05 MIN
0.15 MAX SIDE VIEW 0.60 В±0.15 DETAIL "X" (1.45)
NOTES: (5.65) ( 3.00) 1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead …
