Plastic Packages for Integrated Circuits Package Outline Drawing
L8.2x3C
8 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE 0.5mm THICK (UTDFN)
Rev 1, 04/16
0.10 M C A B
8X
0.25 В±0.05
0.50 BSC 0.50 В±0.05 B 0.30 В±0.10 4 5 PIN 1 INDEX AREA
3.00 В±0.05 1.30 В±0.10 5 PIN 1 INDEX AREA
A 1.50 В±0.10 0.0 -0.05 2.00 В±0.05 BOTTOM VIEW TOP VIEW DETAIL A 0.05 C (6 x 0.50 BSC) PACKAGE OUTLINE 8X (8 x 0.25) 0.127 REF. 0.05 C
C 0.127 + 0.058
-0.008
TERMINAL THICKNESS 4 0.127 В±0.008
(1.30) 0.0 -0.05
DETAIL A (8 x 0.20)
(8 x 0.50)
(1.50)
TYPICAL RECOMMENDED LAND PATTERN NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance: Decimal В±0.05 4. Dimension applies to the metallized terminal and is measured
between 0.018mm and 0.30mm from the terminal tip. 5. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature. 1 …
