Hermetic Packages for Integrated Circuits
Ceramic Leadless Chip Carrier Packages (CLCC)
J3.A B D 3 PAD HERMETIC SMD.5 PACKAGE
CERAMIC BOTTOM TERMINAL CHIP CARRIER
INCHES E A
TOP VIEW SYMBOL MIN MAX MIN MAX NOTES A 0.110 0.124 2.79 3.15 3 A1 0.010 0.020 0.25 0.51 -b 0.281 0.291 7.13 7.39 -b1 0.220 0.230 5.58 5.84 -b2 0.090 0.100 2.28 2.54 -b3 0.115 0.125 2.92 3.18 -D 0.395 0.405 10.03 10.28 -D1 0.030 -0.76 -E 0.291 0.301 7.39 7.64 -e
A1 A C 1.91 BSC -NOTES:
1. Controlling dimensions are in inches (mm for reference only).
2. Dimensioning and tollorance per ANSI Y14.5M -1982 SIDE VIEW C 0.075 BSC Rev. 2 1/14 (3 PLCS)
0.004 MILLIMETERS 3. The maximum “A” dimension is package height before being
solder dipped.
4. Patterned after MIL-STD-1835 CBCC1-N3 (C-B1) Note: Not
meeting the Mil-Std “A” min. dimension of 0.112
D1 b1 b3 (2 PLCS) 2
3 e (2 PLCS) b
1 b2
0.014 M C A BOTTOM VIEW 1 (2 PLCS) …
