Hermetic Packages for Integrated Circuits
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
c1
-A-D8.3 MIL-STD-1835 CDIP2-T8 (D-4, CONFIGURATION C) LEAD FINISH 8 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE
METAL E b1
M
(b) M
-Bbbb S C A -B S INCHES SECTION A-A D S D BASE
PLANE Q S2
-C-SEATING
PLANE A
L S1 eA A A b2
b e eA/2 c aaa M C A -B S D S ccc M C A -B S D S NOTES:
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces …
