Datasheet Texas Instruments TDA3LADBABFQ1 — Ficha de datos

Fabricante	Texas Instruments
Serie	TDA3LA
Numero de parte	TDA3LADBABFQ1

Hojas de datos

Precios

Estado

Embalaje

Paramétricos

Plan ecológico

Kits de diseño y Módulos de evaluación

• Evaluation Modules & Boards: TDA3XEVM
  TDA3X Evaluation Module
  Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  
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Notas de aplicación

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  ADC as Voltage Monitoring in TDA3x
  PDF, 29 Kb, Archivo publicado: jun 20, 2016
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  TDA3xx ISS Tuning and Debug Infrastructure
  PDF, 89 Kb, Archivo publicado: jun 2, 2016
  A camera system has many components including image sensor, optics and an Image Signal Processor (ISP). To get the best image quality, each subsystem must be configured to operate at the optimal level. The interdependencies between different subsystems must be utilized to get the best results. Additionally, there are many tradeoffs to be made while determining the best sensor and ISP configuration
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  TDA3x Error Signaling Module (ESM)
  PDF, 402 Kb, Archivo publicado: enero 26, 2016
  The Error Signaling Module (ESM) in TDA3x is used to report certain activity on the monitored signals at an external error pin or to the device CPUs through interrupt. The external error pin is normally used as a second indication path to switch off (or reset) the device by an external device. Therefore, the external controller is able to reset the device or keep the system in a fail-safe state by
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  TDA3xx Tester On Chip (TESOC)
  PDF, 374 Kb, Archivo publicado: enero 26, 2016
  This application report explains how to use the Tester On Chip (hereafter mentioned as TESOC) module of TDA3xx SoC. It also provides detailed design information for using TESOC to run field tests on targeted modules in the TDA3xx System-on-Chip (SoC). Flow charts and other programming details are presented for writing code for TESOC. This document is intended for designers and programmers who wish
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  IISS Image Pipe for Alternate CFA Formats
  PDF, 55 Kb, Archivo publicado: agosto 16, 2017
  TDAxx ISS offers a powerful and feature rich Image Pipe for processing RAW sensor data and generating a high quality output stream. Image pipe is configurable allowing the users to adjust image quality based on sensor properties and tuning preferences. To enable this TI delivers example processing pipelines in Vision Software Development Kit (SDK) and PC based graphical tool for image quality tuni
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  DSS BT656 Workaround for TDA2x
  PDF, 141 Kb, Archivo publicado: marzo 29, 2016
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  TDA2x/TDA2E Performance
  PDF, 6.6 Mb, Archivo publicado: jul 19, 2016
  This application report provides information on the TDA2xx and TDA2ex device throughput performances and describes the TDA2xx and TDA2ex System-on-Chip (SoC) architecture, data path infrastructure, and constraints that affect the throughput and different optimization techniques for optimum system performance. This document also provides information on the maximum possible throughput performance of
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  Quad Channel Camera Application for Surround View and CMS Camera Systems (Rev. A)
  PDF, 485 Kb, Revisión: A, Archivo publicado: agosto 23, 2016
  This application report discusses in detail a reference design jointly developed between OmniVision Technologies, Inc. and Texas Instruments, Inc. It interconnects Megapixel Image Sensors with the TDA2x ADAS Applications Processor. In order to bridge long distances over coax cables, TI's FPD-Link III technology comes into play. The concept proves a method over which continuous high speed transfers
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  DSS Bit Exact Output
  PDF, 115 Kb, Archivo publicado: enero 11, 2016
  The display subsystem (DSS) in TDA2xx, TDA2Ex and TDA3xx platform is used for displaying video data to external devices. But DSS can also be used as a high-speed data transfer port for any non video data. One of the basic requirements of the data transfer port is that the data that is present in the memory should not be modified before the data is sent out, which means the data sent should be bit
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  ADAS Power Management
  PDF, 1.3 Mb, Archivo publicado: marzo 7, 2016
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  A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. A)
  PDF, 3.2 Mb, Revisión: A, Archivo publicado: agosto 19, 2016
  Being able to look into the state of the device when an application fails to run as expected is a key enabler while debugging the application. This application report walks through the different steps required to setup the TI Code Composer Studioв„ў (CCS), as well as how to debug applications on the DRA7x, TDA2x and TDA3x family of devices. The document starts with describing basic CCS debugging tec
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  Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. A)
  PDF, 132 Kb, Revisión: A, Archivo publicado: jun 14, 2017
  The purpose of this application report is to provide guidance on configuring DRA7xx and TDA2xx processors to meet video Serializer/Deserializer (SerDes) jitter requirements.
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  Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device
  PDF, 612 Kb, Archivo publicado: agosto 13, 2014
  This application report provides a methodology through which performance issues can be identified and fixed in systems using DRA74x, DRA75x, TDA2x and TDA3x family of devices.
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  ECC/EDC on TDAxx (Rev. A)
  PDF, 109 Kb, Revisión: A, Archivo publicado: jul 5, 2017
  TDA2x and TDA3x series of automotive processor are designed to be used in automotive safety systems. To enable safety, these processors come with error detection and correction (EDC) support for various memories. This application report provides an overview and usage description of EDC.
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  Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A)
  PDF, 148 Kb, Revisión: A, Archivo publicado: dic 15, 2016
  This application report lists various quality-of-service (QoS) knobs that are implemented in DRA74x, DRA75x and TDA2x system-on-chip (SoC) family of devices. These QoS knobs aid to optimize overall system performance while running several concurrent application scenarios.
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  EMIF Tools (Rev. A)
  PDF, 207 Kb, Revisión: A, Archivo publicado: jun 5, 2017
  At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes

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Clasificación del fabricante

• Semiconductors > Processors > Automotive Processors > TDAx ADAS SoCs