Datasheet Texas Instruments TPS65632ARTET — Ficha de datos

Fabricante	Texas Instruments
Serie	TPS65632A
Numero de parte	TPS65632ARTET

Salidas triples Pantalla AMOLED Fuente de alimentación 16-WQFN -40 a 85

Hojas de datos

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PDF, 803 Kb, Archivo publicado: agosto 7, 2012

Extracto del documento

To request a full data sheet, please send an email to:
display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 5-Feb-2015 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking
(4/5) TPS65632ARTER ACTIVE WQFN RTE 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TPS65632ARTET PREVIEW WQFN RTE 16 250 TBD Call TI Call TI -40 to 85 SEM (1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan -The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) -please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a …

Precios

Estado

Estado del ciclo de vida	Vista previa (El dispositivo ha sido anunciado pero no está en producción. Las muestras pueden o no estar disponibles)
Disponibilidad de muestra del fabricante	No

Embalaje

Pin	16
Package Type	RTE
Industry STD Term	WQFN
JEDEC Code	S-PQFP-N
Package QTY	250
Carrier	SMALL T&R
Width (mm)	3
Length (mm)	3
Thickness (mm)	0.75
Pitch (mm)	0.5
Max Height (mm)	0.8
Mechanical Data	Descargar

Paramétricos

DisplayType	AMOLED
IC Integration	AMOLED Bias
Pin/Package	16WQFN
Source Driver Voltage(Max)	7.7 V
Source Driver Voltage(Min)	7.7 V
Special Function	Digital Control I/F
Target Application	7 inches or less
Topology	Boost,Buck-Boost
V_NEG(Max)	-4 V
V_NEG(Min)	-4 V
V_POS(Max)	4.6 V
V_POS(Min)	4.6 V
Vin(Max)	4.5 V
Vin(Min)	2.9 V

Plan ecológico

RoHS	Desobediente

Notas de aplicación

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Basic Calculation of an Inverting Buck-Boost Power Stage (Rev. A)
PDF, 431 Kb, Revisión: A, Archivo publicado: agosto 28, 2017
This application note provides basic formulas that you need to design the power stage of an invertingbuck-boost converter. The premise is that the power switch is integrated in the IC and the rectification isdone by a diode (non-synchronous power stage). It provides all the formulas and considerations that youneed to select the external power components such as the inductor the diode and t
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Understanding Undervoltage Lockout in Power Devices (Rev. A)
PDF, 90 Kb, Revisión: A, Archivo publicado: sept 19, 2018
Many integrated circuits include an undervoltage lockout (UVLO) function to disable the device at low supply voltages. Below the minimum supply voltage the function and performance of a device may be undefined making it impossible to predict system behavior. This application note explains how to correctly understand the undervoltage lockout specification in the data sheets of TI's power products.
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Minimizing Ringing at the Switch Node of a Boost Converter
PDF, 201 Kb, Archivo publicado: sept 15, 2006
The application report explains how to use proper board layout and/or a snubber to reduce high-frequency ringing at the switch node of a boost converter.
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Basic Calculation of a Boost Converter's Power Stage (Rev. C)
PDF, 186 Kb, Revisión: C, Archivo publicado: enero 8, 2014
This application note gives the equations to calculate the power stage of a boost converter built with an IC with integrated switch and operating in continuous conduction mode. It is not intended to give details on the functionality of a boost converter (see Reference 1) or how to compensate a converter. See the references at the end of this document if more detail is needed.

Linea modelo

Serie: TPS65632A (2)

TPS65632ARTER TPS65632ARTET

Clasificación del fabricante

Semiconductors > Power Management > LCD/OLED Display Bias Solutions