Datasheet MCP601, MCP601R, MCP602, MCP603, MCP604 (Microchip) - 4
| Fabricante | Microchip |
| Descripción | MCP601 operational amplifier (op amp) has a gain bandwidth product of 2.8 MHz with low typical operating current of 230 uA and an offset voltage that is less than 2 mV |
| Páginas / Página | 34 / 4 — MCP601/1R/2/3/4. TEMPERATURE CHARACTERISTICS. Electrical Specifications:. … |
| Formato / tamaño de archivo | PDF / 600 Kb |
| Idioma del documento | Inglés |
MCP601/1R/2/3/4. TEMPERATURE CHARACTERISTICS. Electrical Specifications:. Parameters. Sym. Min. Typ. Max. Units. Conditions
Línea de modelo para esta hoja de datos
- MCP601-E/P MCP601-E/SN MCP601-E/ST MCP601-I/P MCP601-I/SN MCP601-I/ST MCP601RT-E/OT MCP601RT-I/OT MCP601T-E/OT MCP601T-E/OTVAO MCP601T-E/SN MCP601T-E/ST MCP601T-I/OT MCP601T-I/OTG MCP601T-I/SN MCP601T-I/ST
- MCP602-E/P MCP602-E/SN MCP602-E/ST MCP602-I/P MCP602-I/SN MCP602-I/ST MCP602T-E/SN MCP602T-E/ST MCP602T-E/STVAO MCP602T-I/SN MCP602T-I/ST
- MCP603-E/P MCP603-E/SN MCP603-E/ST MCP603-I/P MCP603-I/SN MCP603-I/ST MCP603T-E/CH MCP603T-E/SN MCP603T-E/ST MCP603T-I/CH MCP603T-I/SN MCP603T-I/ST
- MCP604-E/P MCP604-E/SL MCP604-E/ST MCP604-E/STVAO MCP604-I/P MCP604-I/SL MCP604-I/ST MCP6041-E/MS MCP6041-E/P MCP6041-E/SN MCP6041-E/SNVAO MCP6041-I/MS MCP6041-I/P MCP6041-I/SN MCP6041T-E/MS MCP6041T-E/OT MCP6041T-E/OTVAO MCP6041T-E/SN MCP6041T-I/MS MCP6041T-I/OT MCP6041T-I/OTG MCP6041T-I/SN MCP6042-E/MS MCP6042-E/MSVAO MCP6042-E/P MCP6042-E/SN MCP6042-E/SNVAO MCP6042-I/MS MCP6042-I/P MCP6042-I/SN MCP6042T-E/MS MCP6042T-E/MSVAO MCP6042T-E/SN MCP6042T-E/SNVAO MCP6042T-I/MS MCP6042T-I/SN MCP6043-E/MS MCP6043-E/P MCP6043-E/SN MCP6043-I/MS MCP6043-I/P MCP6043-I/SN MCP6043T-E/CH MCP6043T-E/MS MCP6043T-E/SN MCP6043T-I/CH MCP6043T-I/MS MCP6043T-I/SN MCP6044-E/P MCP6044-E/SL MCP6044-E/ST MCP6044-I/P MCP6044-I/SL MCP6044-I/ST MCP6044T-E/SL MCP6044T-E/ST MCP6044T-E/STVAO MCP6044T-I/SL MCP6044T-I/ST MCP604T-E/SL MCP604T-E/ST MCP604T-E/STVAO MCP604T-I/SL MCP604T-I/ST
Versión de texto del documento
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MCP601/1R/2/3/4 TEMPERATURE CHARACTERISTICS Electrical Specifications:
Unless otherwise indicated, VDD = +2.7V to +5.5V and VSS = GND.
Parameters Sym Min Typ Max Units Conditions Temperature Ranges
Specified Temperature Range TA -40 — +85 °C Industrial temperature parts TA -40 — +125 °C Extended temperature parts Operating Temperature Range TA -40 — +125 °C
Note
Storage Temperature Range TA -65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 5L-SOT23 θJA — 256 — °C/W Thermal Resistance, 6L-SOT23 θJA — 230 — °C/W Thermal Resistance, 8L-PDIP θJA — 85 — °C/W Thermal Resistance, 8L-SOIC θJA — 163 — °C/W Thermal Resistance, 8L-TSSOP θJA — 124 — °C/W Thermal Resistance, 14L-PDIP θJA — 70 — °C/W Thermal Resistance, 14L-SOIC θJA — 120 — °C/W Thermal Resistance, 14L-TSSOP θJA — 100 — °C/W
Note:
The Industrial temperature parts operate over this extended range, but with reduced performance. The Extended temperature specs do not apply to Industrial temperature parts. In any case, the internal Junction temperature (TJ) must not exceed the absolute maximum specification of 150°C.
1.1 Test Circuits
The test circuits used for the DC and AC tests are shown in Figure 1-2 and Figure 1-2. The bypass capacitors are laid out according to the rules discussed in
Section 4.5 “Supply Bypass”
. VDD 1 µF V 0.1 µF IN R V N OUT
MCP60X
CL RL R V G RF DD/2 VL
FIGURE 1-2:
AC and DC Test Circuit for Most Non-Inverting Gain Conditions. VDD 1 µF V 0.1 µF DD/2 R V N OUT
MCP60X
CL RL R V G RF IN VL
FIGURE 1-3:
AC and DC Test Circuit for Most Inverting Gain Conditions. DS21314G-page 4 © 2007 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics FIGURE 1-1: MCP603 Chip Select (CS) Timing Diagram. 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-2: Slew Rate vs. Temperature. FIGURE 2-3: Gain Bandwidth Product, Phase Margin vs. Temperature. FIGURE 2-4: Quiescent Current vs. Supply Voltage. FIGURE 2-5: Quiescent Current vs. Temperature. FIGURE 2-6: Input Noise Voltage Density vs. Frequency. FIGURE 2-7: Input Offset Voltage. FIGURE 2-8: Input Offset Voltage vs. Temperature. FIGURE 2-9: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 2.7V. FIGURE 2-10: Input Offset Voltage Drift. FIGURE 2-11: CMRR, PSRR vs. Temperature. FIGURE 2-12: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 5.5V. FIGURE 2-13: Channel-to-Channel Separation vs. Frequency. FIGURE 2-14: Input Bias Current, Input Offset Current vs. Ambient Temperature. FIGURE 2-15: DC Open-Loop Gain vs. Load Resistance. FIGURE 2-16: CMRR, PSRR vs. Frequency. FIGURE 2-17: Input Bias Current, Input Offset Current vs. Common Mode Input Voltage. FIGURE 2-18: DC Open-Loop Gain vs. Supply Voltage. FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Load Resistance. FIGURE 2-20: Output Voltage Headroom vs. Output Current. FIGURE 2-21: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-22: DC Open-Loop Gain vs. Temperature. FIGURE 2-23: Output Voltage Headroom vs. Temperature. FIGURE 2-24: Output Short-Circuit Current vs. Supply Voltage. FIGURE 2-25: Large Signal Non-Inverting Pulse Response. FIGURE 2-26: Small Signal Non-Inverting Pulse Response. FIGURE 2-27: Chip Select Timing (MCP603). FIGURE 2-28: Large Signal Inverting Pulse Response. FIGURE 2-29: Small Signal Inverting Pulse Response. FIGURE 2-30: Quiescent Current Through VSS vs. Chip Select Voltage (MCP603). FIGURE 2-31: Chip Select Pin Input Current vs. Chip Select Voltage. FIGURE 2-32: Hysteresis of Chip Select’s Internal Switch. FIGURE 2-33: The MCP601/1R/2/3/4 family of op amps shows no phase reversal under input overdrive. FIGURE 2-34: Measured Input Current vs. Input Voltage (below VSS). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table For Single Op Amps TABLE 3-2: Pin Function Table For Dual And Quad Op Amps 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Chip Select Digital Input 3.4 Power Supply Pins 4.0 Applications Information 4.1 Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Unity Gain Buffer has a Limited VOUT Range. 4.2 Rail-to-Rail Output 4.3 MCP603 Chip Select 4.4 Capacitive Loads FIGURE 4-4: Output resistor RISO stabilizes large capacitive loads. FIGURE 4-5: Recommended RISO values for capacitive loads. 4.5 Supply Bypass 4.6 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.7 PCB Surface Leakage FIGURE 4-7: Example Guard Ring layout. 4.8 Typical Applications FIGURE 4-8: Second-Order, Low-Pass Sallen-Key Filter. FIGURE 4-9: Second-Order, Low-Pass Multiple-Feedback Filter. FIGURE 4-10: Three-Op Amp Instrumentation Amplifier. FIGURE 4-11: Two-Op Amp Instrumentation Amplifier. FIGURE 4-12: Photovoltaic Mode Detector. FIGURE 4-13: Photoconductive Mode Detector. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Mindi™ Simulatior Tool 5.4 MAPS (Microchip Advanced Part Selector) 5.5 Analog Demonstration and Evaluation Boards 5.6 Application Notes 6.0 Packaging Information 6.1 Package Marking Information
MCP601/1R/2/3/4 TEMPERATURE CHARACTERISTICS Electrical Specifications:
Unless otherwise indicated, VDD = +2.7V to +5.5V and VSS = GND.
Parameters Sym Min Typ Max Units Conditions Temperature Ranges
Specified Temperature Range TA -40 — +85 °C Industrial temperature parts TA -40 — +125 °C Extended temperature parts Operating Temperature Range TA -40 — +125 °C
Note
Storage Temperature Range TA -65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 5L-SOT23 θJA — 256 — °C/W Thermal Resistance, 6L-SOT23 θJA — 230 — °C/W Thermal Resistance, 8L-PDIP θJA — 85 — °C/W Thermal Resistance, 8L-SOIC θJA — 163 — °C/W Thermal Resistance, 8L-TSSOP θJA — 124 — °C/W Thermal Resistance, 14L-PDIP θJA — 70 — °C/W Thermal Resistance, 14L-SOIC θJA — 120 — °C/W Thermal Resistance, 14L-TSSOP θJA — 100 — °C/W
Note:
The Industrial temperature parts operate over this extended range, but with reduced performance. The Extended temperature specs do not apply to Industrial temperature parts. In any case, the internal Junction temperature (TJ) must not exceed the absolute maximum specification of 150°C.
1.1 Test Circuits
The test circuits used for the DC and AC tests are shown in Figure 1-2 and Figure 1-2. The bypass capacitors are laid out according to the rules discussed in
Section 4.5 “Supply Bypass”
. VDD 1 µF V 0.1 µF IN R V N OUT
MCP60X
CL RL R V G RF DD/2 VL
FIGURE 1-2:
AC and DC Test Circuit for Most Non-Inverting Gain Conditions. VDD 1 µF V 0.1 µF DD/2 R V N OUT
MCP60X
CL RL R V G RF IN VL
FIGURE 1-3:
AC and DC Test Circuit for Most Inverting Gain Conditions. DS21314G-page 4 © 2007 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics FIGURE 1-1: MCP603 Chip Select (CS) Timing Diagram. 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-2: Slew Rate vs. Temperature. FIGURE 2-3: Gain Bandwidth Product, Phase Margin vs. Temperature. FIGURE 2-4: Quiescent Current vs. Supply Voltage. FIGURE 2-5: Quiescent Current vs. Temperature. FIGURE 2-6: Input Noise Voltage Density vs. Frequency. FIGURE 2-7: Input Offset Voltage. FIGURE 2-8: Input Offset Voltage vs. Temperature. FIGURE 2-9: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 2.7V. FIGURE 2-10: Input Offset Voltage Drift. FIGURE 2-11: CMRR, PSRR vs. Temperature. FIGURE 2-12: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 5.5V. FIGURE 2-13: Channel-to-Channel Separation vs. Frequency. FIGURE 2-14: Input Bias Current, Input Offset Current vs. Ambient Temperature. FIGURE 2-15: DC Open-Loop Gain vs. Load Resistance. FIGURE 2-16: CMRR, PSRR vs. Frequency. FIGURE 2-17: Input Bias Current, Input Offset Current vs. Common Mode Input Voltage. FIGURE 2-18: DC Open-Loop Gain vs. Supply Voltage. FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Load Resistance. FIGURE 2-20: Output Voltage Headroom vs. Output Current. FIGURE 2-21: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-22: DC Open-Loop Gain vs. Temperature. FIGURE 2-23: Output Voltage Headroom vs. Temperature. FIGURE 2-24: Output Short-Circuit Current vs. Supply Voltage. FIGURE 2-25: Large Signal Non-Inverting Pulse Response. FIGURE 2-26: Small Signal Non-Inverting Pulse Response. FIGURE 2-27: Chip Select Timing (MCP603). FIGURE 2-28: Large Signal Inverting Pulse Response. FIGURE 2-29: Small Signal Inverting Pulse Response. FIGURE 2-30: Quiescent Current Through VSS vs. Chip Select Voltage (MCP603). FIGURE 2-31: Chip Select Pin Input Current vs. Chip Select Voltage. FIGURE 2-32: Hysteresis of Chip Select’s Internal Switch. FIGURE 2-33: The MCP601/1R/2/3/4 family of op amps shows no phase reversal under input overdrive. FIGURE 2-34: Measured Input Current vs. Input Voltage (below VSS). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table For Single Op Amps TABLE 3-2: Pin Function Table For Dual And Quad Op Amps 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Chip Select Digital Input 3.4 Power Supply Pins 4.0 Applications Information 4.1 Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Unity Gain Buffer has a Limited VOUT Range. 4.2 Rail-to-Rail Output 4.3 MCP603 Chip Select 4.4 Capacitive Loads FIGURE 4-4: Output resistor RISO stabilizes large capacitive loads. FIGURE 4-5: Recommended RISO values for capacitive loads. 4.5 Supply Bypass 4.6 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.7 PCB Surface Leakage FIGURE 4-7: Example Guard Ring layout. 4.8 Typical Applications FIGURE 4-8: Second-Order, Low-Pass Sallen-Key Filter. FIGURE 4-9: Second-Order, Low-Pass Multiple-Feedback Filter. FIGURE 4-10: Three-Op Amp Instrumentation Amplifier. FIGURE 4-11: Two-Op Amp Instrumentation Amplifier. FIGURE 4-12: Photovoltaic Mode Detector. FIGURE 4-13: Photoconductive Mode Detector. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Mindi™ Simulatior Tool 5.4 MAPS (Microchip Advanced Part Selector) 5.5 Analog Demonstration and Evaluation Boards 5.6 Application Notes 6.0 Packaging Information 6.1 Package Marking Information